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Is the PC Dead?

Folks, Let’s see how Patty is recovering from her conflict with Hal Lindsay……. Patty saw a link on one of the daily SMT Tech newsletters that piqued her interest. It was titled, “A New Alloy

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異種金屬的電化腐蝕

並非所有的金屬都能很好地搭配。這也滲透到電子產品及其所使用的材料領域。一個相對較新且相關的例子是隨著 RoHS 和

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Per Homogeneous Material Also Applies to Medical Devices Under RoHS

Folks, It's been awhile, let's see what Patty is up to… Patty was in her office, finishing lunch and reading Golf Digest. She was happy to see Tiger Woods doing better, but a little

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用於薄膜太陽能電池的硫化銦

Here’s an interesting technology fact I just learned: Indium Sulfide was the very first indium compound to be discovered. I bet Reich and Richter (the discovers of indium) never imagined that

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首次通過良率 續

Folks, Let’s see how Patty is doing with her latest challenge….. Patty had decided to call The Professor and see what advice he had to offer in preparation for her visit to the facility

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首件通過良率和生產率很高,但利潤卻很低?

各位,讓我們看看 Patty 是怎麼回事........。Patty 坐在電腦前,誠然有點疲倦。她剛在威廉斯堡殖民地度完一個星期的假,回來就和

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銅柱微凸塊的回流焊

晶圓凸塊製程在過去 10 年間不斷演進。半導體組裝產業已從使用焊膏印刷的凸塊製程(存在所有的無效問題)轉變為使用錫膏印刷的凸塊製程(存在所有的無效問題)、

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Leadframe Solderability Issues in Power Semiconductors

It is no secret that automotive semiconductor customers are becoming increasingly demanding. The “under the hood / bonnet” electronics environment is arguably one of the most thermally

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Annealing NanoFoil®

NanoFoil®requires a threshold of energy to activate. What happens if that energy value is not met?: Interdiffusion and inhibition of the NanoBond® reaction. This can happen if NanoFoil®

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Soldering to Wood

Many surface finishes are solderable with the right flux. Many of our electronic devices use solder to bond copper, silver, gold, and other metals, but did you know that you can solder wooden

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什麼是銦?

Being the Indium Corporation, we know what indium is, where it comes from, and how to use it. But sometimes we forget that not everyone is as immersed in indium as we are. So what is indium? Of

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Wet Gold: A Technique to Measure Density Without Knowing the Volume

Folks, In the category of interesting requests, Ron, a gold worker, from Guyana, sent me the following note: Dr. Ron, My colleagues use a “wet” gold technique to measure gold alloy

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DIY: Applying Solder to Molybdenum, Titanium, and Tungsten (Ultrasonic Soldering)

There are many sputtering target materials that are tricky to solder to. For those alloys we ‘bring out the big guns’ – in this case, our ultrasonic soldering

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DIY: Applying Solder to Copper, Nickel, and Platinum (Flux)

In order to NanoBond® parts that are made out of copper, nickel, or platinum, we must first apply solder to the bonding surface. This is most commonly done by melting solder directly onto the

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Weibull Analysis III: Multiple Failure Modes

Folks, Our discussion of Weibull Analysis continues…..Let’s say you have worked hard and assembled some SMT lead-free PCBs for thermal cycle testing. You used the best lead-free solder paste,

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DIY: Connecting NanoFoil®

Sometimes one piece of NanoFoil® just isn’t enough… We often NanoBond® sputtering targets which are large enough to require multiple sheets of NanoFoil® to cover the width or

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DIY: Hand Cutting NanoFoil®

Hand cutting is only one option for shaping NanoFoil®, however it is quick, easy, and inexpensive. All you need to cut NanoFoil® with this method is a good cutting surface, metal straight

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Weibull Analysis II: The Curse of the Early First Failure

Folks, In continuing our discussion on Weibull Analysis, let’s assume we assembled some SMT and through-hole PCBs with lead-free solder paste. On this board are also some bottom-side terminated

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DIY: Electroplating NanoFoil®

A few years back, Indium Corporation's own Eric Bastow set up a prototype NanoFoil® plating process to demonstrate the material and cost savings of setting up a small plating bath. One of the

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Time Required for Refrigerated Flux and Solder Paste to Reach Room Temperature

One question that I often hear from customers is; “Once out of the refrigerator, how long do I have to wait to allow my solder paste and/or flux to reach room temperature in order to use

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解決焊料預型件濕潤不良和不擴散的缺陷

我們聽過焊錫膏的「グラグ」缺陷,但同樣的氧化挑戰也發生在其他焊錫形式中,例如用於固定小型焊錫的焊錫墊圈預型件。

在 Indium,我們研究、開發並製造先進的電子組裝材料解決方案,以因應今日、明日及未來的挑戰。