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Sample Size Matters in Weibull Analysis Too

Folks, Some time ago I posted on “The Curse of the Early First Fail” and “Interpreting Weibull Plots.” Both of these posts related to using Weibull analysis to make sound engineering

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What a J-STD-004 classification of “OR” means and what it doesn’t mean

Most SMT fluxes and solder pastes are either classified as RO or OR. Every once in a while one will see an occasional RE flux. People typically recognize ROL0 and ROL1 classified fluxes and solder

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Donuts and Solder Preforms – Seriously?

I just can’t get enough of a good thing. My last post mentioned donuts – one of my favorite treats. Allow me to continue reveling in the chewy sweet delight. On Saturdays the kids like to be

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An Example of Cpk and Non Normal Data In Electronics Assembly Soldering

Folks, Let’s see how Patty is doing after teaching her first class at Ivy U… Patty arrived at home after teaching her first class at Ivy U and she couldn’t contain her

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Galvanic Corrosion of Indium and Aluminum….Is it Really a Concern???

My colleagues and I have had several conversations with customers wanting to use indium against an aluminum surface, either for the sake of creating a compression seal or thermal path. A troubling

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Le Cpk ne peut être calculé qu'à partir de données normalement distribuées.

Folks, Let’s look in on Patty…. Patty was really nervous. As a matter of fact, there was no time she remembered being this nervous. The cause of her nervousness? She was going to teach a

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Application de brasage OSP BGA en une étape

The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the

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Printer Process Set-up

Over the last few years, miniaturization, and the drive for increased yields and lower defect rates, have forced the electronics manufacturing industry to focus more on the printing process to obtain

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Effet de la taille de l'emballage et de la matrice sur le trempage et le ramassage

Lors d'un séjour en Asie du Sud-Est l'été dernier, l'équipe technique d'Indium et moi-même avons eu l'occasion de discuter des procédés de trempage des puces à flip-chip avec un grand équipementier.

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The Importance of Oxygen Barrier in Solder Pastes

Folks, Pity the solder scientists of the late 1970s and early 1980s. SMT was an emerging technology and the world wanted to buy solder paste. However, the only experience many solder scientists had

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Choix d'un leadframe ou d'une finition DBC pour l'attachement à la matrice dans les dispositifs de puissance

Solderability and Wetting The wetting and spreading of solder onto surfaces is an essential part of forming a strong, reliable, conductive joint. The term "solderability"is a way of talking

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Lack of Concern for Tin Pest as a Reliability Issue in Mission Critical Products Still Hard to Understand

Folks, My recent post on tin whiskers sparked the memory of tin pest in my mind. I have to admit, that with all of the legitimate reliability concerns related to tin whiskers, I am surprised that

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RDSON et résistivité du volume de soudure

Cette semaine, un client chinois a posé une question intéressante sur la résistivité volumique de la soudure. Mon ami Eric Bastow a suggéré qu'Indium mette ces informations à la disposition de tous sur un blog.

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Solder 101: Forms of Indium Metal

People use indium in many forms – to create many different products. Certain forms fit various applications. Here are some of the many forms of pure indium that we provide: Ingot – this

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Bi/Sn/Ag: The Perfect Tabbing Ribbon Coating Solder Alloy?

Let’s quickly review the advantages of Bi/Sn/Ag alloy tabbing ribbon coating before we discuss them further: Low temperature melting point Pb-free, by definition Beneficial mechanical

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Joints à vide, hermétiques et cryogéniques en indium

Due to its softness and compressibility, indium is ideal for use in creating a seal. Generally 99.99% indium is adequate for a vacuum, hermetic or cryogenic seal, but higher purities are also

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Calcul de l'utilisation de la pâte à braser

Many people try to determine the volume of solder paste that they will use on a given circuit board or during a full production

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Is the PC Dead?

Folks, Let’s see how Patty is recovering from her conflict with Hal Lindsay……. Patty saw a link on one of the daily SMT Tech newsletters that piqued her interest. It was titled, “A New Alloy

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Corrosion galvanique de métaux dissemblables

Tous les métaux ne font pas bon ménage. Et cela se répercute dans le monde de l'électronique et des matériaux qui y sont utilisés. Un exemple relativement nouveau et pertinent est apparu avec l'avènement de la directive RoHS et de la directive sur l'étiquetage des produits chimiques.

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Per Homogeneous Material Also Applies to Medical Devices Under RoHS

Folks, It's been awhile, let's see what Patty is up to… Patty was in her office, finishing lunch and reading Golf Digest. She was happy to see Tiger Woods doing better, but a little

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Indium Sulfide for Thin Film Solar Cells

Here’s an interesting technology fact I just learned: Indium Sulfide was the very first indium compound to be discovered. I bet Reich and Richter (the discovers of indium) never imagined that

Chez Indium, nous recherchons, développons et fabriquons des matériaux d'assemblage électroniques avancés pour répondre aux défis d'aujourd'hui, de demain et de l'avenir.