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Corrosion – Part 4, Learn More

Here is a pretty good list of resources on the topic of corrosion, if you’re interested: 1. Chongchen Xu. “Corrosion in Microelectronics“ 2003 2. Charles A. Harper. Electronic

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Corrosion – Part 3, Sources and Prevention

Corrosion is caused by an electrochemical reaction between two dissimilar metals, one acting as an anode – one as a cathode. Halide ions, such as fluoride, bromide, and chloride, are the usual

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Corrosion – Part 2, How It Affects Us

Corrosion leads to field failures. I could probably stop right there – that’s bad enough. To flesh that out a little more, corrosion can lower thermal and electrical conductivity, cause

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Corrosione - Parte 1, cos'è

Questa è la prima di una serie di 4 parti sulla corrosione: 1) Cos'è la corrosione, 2) Come ci influenza, 3) Fonti di corrosione e prevenzione e 4) Come saperne di più. La corrosione si presenta in 3 forme fondamentali

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Preform Flux Types

When considering the choice of flux for preforms, in addition to factoring in the amount of flux required on a preform, the type of flux is also important. Fluxes are categorized using the

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SAC305 May Not Become De-Facto Standard

Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. With the increased need for shock resistance in

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Are There Even Better Performing Thermal Interface Materials available Than Metal?

Multiple times I have discussed the intrinsic properties of metal thermal interface materials which make them the top performer on the market today. With thermal conductivities of 86W/mK, there is

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Why Invest in a Great Thermal Interface Material?

There are some applications which can function fine with grease at the thermal interface or even with no thermal interface material at all. This was the case for most electronics of the

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Soldering to Stainless Steel

Have you ever had that sinking feeling when you tried soldering to stainless steel and found it to be very draining? You can join stainless steel, you know, and here's how! You need the correct

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Senza alogeni e senza alogenuri

There is a significant push in the electronics industry to produce “halogen-free” products in order to be more environmentally friendly. The industry has begun to adopt the definition of

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Package-on-Package Component Dipping (2/5)

Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surface of the flux reservoir. You can check this by

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Au/Sn – One of a Kind

For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if you don’t factor cost into it). Although the cost of the

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Control Your Materials, or They Will Control You (part 1)

Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are

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Erogazione di pasta saldante per stampaggio

The picture shows a “Dispensing Component Kit”. I find this is extremely helpful in quickly verifying your powder/needle combination. This particular kit is put together by EFD. As

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Questions for Tim Jensen

Folks, Tim Jensen, Product Manager, PCB Assembly Materials, would surely be considered one of the most knowledgeable people in lead-free soldering and solder materials. I was able to catch up with

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Comprendere i problemi di creep su un diodo impilato.

La parola Creep non è qualcosa che un ingegnere vuole sentire quando progetta un TIM metallico nel suo stack up di diodi laser. Ma il creep è davvero un problema e lo capiamo davvero quando parliamo di creep?

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Indium Oxide Layer

There are multiple types of thermal interface materials available, but due to its high thermal conductivity, compressibility, and ease of application, indium metal is one of the most desired thermal

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Be Data Driven

Folks, I was recently asked to give a presentation and audit an assembly line regarding minimizing "tombstoning" of passives at a major electronic

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01005 Passivi Non proprio 01005 in dimensione

Folks, I mentioned this in the quiz at the left, but am I the only one that didn't know that a 01005 passive is really not that size? The designation 01005 means that the passive should be 0.010

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Jim Hall condivide le nuove insegne sui baffi di latta

Folks, One of my closest and most respected colleagues in our industry is Jim Hall of ITM. Along with Phil Zarrow, also of ITM, Jim and I developed SMTA's Process Certification Workshop and

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L'interesse per la formula per il calcolo della densità delle leghe è ancora vivo

Folks, The technique to calculate density of an alloy still attracts interest about a year after I first discussed it. Although I am pleased to share my Excel software that calculates solder alloy

In Indium ricerchiamo, sviluppiamo e produciamo materiali avanzati per l'assemblaggio dell'elettronica, in grado di rispondere alle sfide di oggi, di domani e del futuro.