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Our engineering group recently recieved a personal win when a prospective customer we have been working with for years finally took notice of out Au/Sn advancements and agreed to run a full

Continuing with the topic of thermal interface material options, a popular material choice is a clad metal thermal interface preform including multiple layers of various metals, or a metal preform

Here is a pretty good list of resources on the topic of corrosion, if you’re interested: 1. Chongchen Xu. “Corrosion in Microelectronics“ 2003 2. Charles A. Harper. Electronic

Corrosion is caused by an electrochemical reaction between two dissimilar metals, one acting as an anode – one as a cathode. Halide ions, such as fluoride, bromide, and chloride, are the usual

Corrosion leads to field failures. I could probably stop right there – that’s bad enough. To flesh that out a little more, corrosion can lower thermal and electrical conductivity, cause

這是關於腐蝕的 4 部分系列的第一部分，內容包括1) 什麼是腐蝕，2) 腐蝕如何影響我們，3) 腐蝕的來源和預防，以及 4) 如何瞭解更多。腐蝕有 3 種基本形式

When considering the choice of flux for preforms, in addition to factoring in the amount of flux required on a preform, the type of flux is also important. Fluxes are categorized using the

Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. With the increased need for shock resistance in

Multiple times I have discussed the intrinsic properties of metal thermal interface materials which make them the top performer on the market today. With thermal conductivities of 86W/mK, there is

There are some applications which can function fine with grease at the thermal interface or even with no thermal interface material at all. This was the case for most electronics of the

Have you ever had that sinking feeling when you tried soldering to stainless steel and found it to be very draining? You can join stainless steel, you know, and here's how! You need the correct

There is a significant push in the electronics industry to produce “halogen-free” products in order to be more environmentally friendly. The industry has begun to adopt the definition of

Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surface of the flux reservoir. You can check this by

For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if you don’t factor cost into it). Although the cost of the

Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are

圖中顯示的是 "Dispensing Component Kit"。我發現這對快速驗證粉末/針的組合非常有幫助。這個特殊的套件是由 EFD 組成的。如圖所示

Folks, Tim Jensen, Product Manager, PCB Assembly Materials, would surely be considered one of the most knowledgeable people in lead-free soldering and solder materials. I was able to catch up with

當工程師將金屬 TIM 設計成雷射二極體堆疊時，蠕變（Creep）一詞是他們不願意聽到的。但蠕變真的是一個問題嗎？

There are multiple types of thermal interface materials available, but due to its high thermal conductivity, compressibility, and ease of application, indium metal is one of the most desired thermal

Folks, I was recently asked to give a presentation and audit an assembly line regarding minimizing "tombstoning" of passives at a major electronic

Folks, I mentioned this in the quiz at the left, but am I the only one that didn't know that a 01005 passive is really not that size? The designation 01005 means that the passive should be 0.010