部落格

Folks I was chatting recently with Indium Corporation's Mike Fenner about Sn/Cu alloys for solder paste.Mike has many years of experience and I value his opinions greatly. Here is a summary of

Au stud bumped flip chip attachment? Low temperature assembly requirements? Indium is your answer… Indium can be used in many ingenious ways to attach flip chips. It can be used for solder

If you deal with indium, this is a book for you. “Phase Diagrams of Indium Alloys and Their Engineering Applications” has information about pure indium and indium

Diagram of Solder-Dipping Test Apparatus Solder-wetting Curve Interesting question from a Power Semiconductor customer this week about how to test solder paste for use in Power die-attach

Folks, Recently I caught up with Ed Briggs, a member of Indium Corporation's technical staff. I asked Ed if he would share with us his thoughts on "graping" and how to minimize it. His

液態熱介面材料有兩種形式：兩者之間的主要差異在於這些合金開始熔化的溫度。液態金屬在室溫下仍保持熔融狀態

Indium Foil used as a thermal interface can easily be handled with pick and place tools. Never worked with indium foil and wondering, "What's all the hype about?" In many ways, indium

How hot are you setting your solder iron for hand soldering using solder wire or preforms? If you are cranking up the solder iron temperature because you have transitioned to lead-free solders, think

最近幾天，我的一位應用工程師同事 Jim Hisert 在他的半導體網站發表了一篇有關铟接合和铟冷焊接的部落格。這是一個經常出現的話題，既

I recently visited a customer to help optimize a flux-less indium soldering application. They admitted they needed flux but didn’t know 1) what to use, or 2) if there was a better way to fix

This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or

As previously posted, Indiums Table of Specialty Alloys and Solders contains hundreds of solder alloys used as thermal interface materials and for each of them, we have listed melting temperatures.

As previously posted, Indiums Table of Specialty Alloys҂and solderscontains hundreds of solder alloys and for each of them, we have listed melting temperatures. The method by which these were

您正在尋找排除故障或優化熱介面材料的方法嗎？我們設計了一種方法來確定您的熱堆疊性能，但不包括熱介面。

Our engineering group recently recieved a personal win when a prospective customer we have been working with for years finally took notice of out Au/Sn advancements and agreed to run a full

Continuing with the topic of thermal interface material options, a popular material choice is a clad metal thermal interface preform including multiple layers of various metals, or a metal preform

Here is a pretty good list of resources on the topic of corrosion, if you’re interested: 1. Chongchen Xu. “Corrosion in Microelectronics“ 2003 2. Charles A. Harper. Electronic

Corrosion is caused by an electrochemical reaction between two dissimilar metals, one acting as an anode – one as a cathode. Halide ions, such as fluoride, bromide, and chloride, are the usual

Corrosion leads to field failures. I could probably stop right there – that’s bad enough. To flesh that out a little more, corrosion can lower thermal and electrical conductivity, cause

這是關於腐蝕的 4 部分系列的第一部分，內容包括1) 什麼是腐蝕，2) 腐蝕如何影響我們，3) 腐蝕的來源和預防，以及 4) 如何瞭解更多。腐蝕有 3 種基本形式

When considering the choice of flux for preforms, in addition to factoring in the amount of flux required on a preform, the type of flux is also important. Fluxes are categorized using the