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Corrosion – Part 4, Learn More
Here is a pretty good list of resources on the topic of corrosion, if you’re interested: 1. Chongchen Xu. “Corrosion in Microelectronics“ 2003 2. Charles A. Harper. Electronic
Korrosion - Teil 3, Quellen und Prävention
Corrosion is caused by an electrochemical reaction between two dissimilar metals, one acting as an anode – one as a cathode. Halide ions, such as fluoride, bromide, and chloride, are the usual
Korrosion - Teil 2: Wie sie sich auf uns auswirkt
Corrosion leads to field failures. I could probably stop right there – that’s bad enough. To flesh that out a little more, corrosion can lower thermal and electrical conductivity, cause
Korrosion - Teil 1, was sie ist
Dies ist der erste Teil einer 4-teiligen Serie über Korrosion, die folgende Themen behandelt: 1) Was Korrosion ist, 2) Wie sie sich auf uns auswirkt, 3) Korrosionsursachen und -prävention und 4) Wie man mehr darüber erfährt. Korrosion gibt es in 3 Grundformen
Preform-Flussmittel-Typen
When considering the choice of flux for preforms, in addition to factoring in the amount of flux required on a preform, the type of flux is also important. Fluxes are categorized using the
SAC305 May Not Become De-Facto Standard
Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. With the increased need for shock resistance in
Are There Even Better Performing Thermal Interface Materials available Than Metal?
Multiple times I have discussed the intrinsic properties of metal thermal interface materials which make them the top performer on the market today. With thermal conductivities of 86W/mK, there is
Why Invest in a Great Thermal Interface Material?
There are some applications which can function fine with grease at the thermal interface or even with no thermal interface material at all. This was the case for most electronics of the
Soldering to Stainless Steel
Have you ever had that sinking feeling when you tried soldering to stainless steel and found it to be very draining? You can join stainless steel, you know, and here's how! You need the correct
Halogenfrei vs. Halogenidfrei
There is a significant push in the electronics industry to produce “halogen-free” products in order to be more environmentally friendly. The industry has begun to adopt the definition of
Package-on-Package Component Dipping (2/5)
Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surface of the flux reservoir. You can check this by
Au/Sn – One of a Kind
For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if you don’t factor cost into it). Although the cost of the
Control Your Materials, or They Will Control You (part 1)
Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are
Dosieren von Die-Attach-Lotpaste
The picture shows a “Dispensing Component Kit”. I find this is extremely helpful in quickly verifying your powder/needle combination. This particular kit is put together by EFD. As
Fragen an Tim Jensen
Folks, Tim Jensen, Product Manager, PCB Assembly Materials, would surely be considered one of the most knowledgeable people in lead-free soldering and solder materials. I was able to catch up with
Die Problematik des Kriechens bei einem Diodenstapel verstehen.
Das Wort "Kriechen" ist nichts, was ein Ingenieur hören möchte, wenn er einen Metall-TIM in seinen Laserdiodenstapel einbaut. Aber ist Kriechen wirklich ein Problem, und verstehen wir Kriechen wirklich, wenn wir über
Indium Oxide Layer
There are multiple types of thermal interface materials available, but due to its high thermal conductivity, compressibility, and ease of application, indium metal is one of the most desired thermal
Datengesteuert sein
Folks, I was recently asked to give a presentation and audit an assembly line regarding minimizing "tombstoning" of passives at a major electronic
01005 Passive Nicht wirklich 01005 in der Größe
Folks, I mentioned this in the quiz at the left, but am I the only one that didn't know that a 01005 passive is really not that size? The designation 01005 means that the passive should be 0.010
Jim Hall teilt neue Insignien auf Tin Whiskers
Folks, One of my closest and most respected colleagues in our industry is Jim Hall of ITM. Along with Phil Zarrow, also of ITM, Jim and I developed SMTA's Process Certification Workshop and
Interesse an Formel zur Berechnung der Legierungsdichte weiterhin groß
Folks, The technique to calculate density of an alloy still attracts interest about a year after I first discussed it. Although I am pleased to share my Excel software that calculates solder alloy
Sie wissen nicht genau, was Sie brauchen?
Wir helfen Ihnen gerne.
Bei Indium erforschen, entwickeln und produzieren wir fortschrittliche Materialien für die Elektronikmontage, die den Herausforderungen von heute, morgen und übermorgen gewachsen sind.

