ブログ

Folks I was chatting recently with Indium Corporation's Mike Fenner about Sn/Cu alloys for solder paste.Mike has many years of experience and I value his opinions greatly. Here is a summary of

Au stud bumped flip chip attachment? Low temperature assembly requirements? Indium is your answer… Indium can be used in many ingenious ways to attach flip chips. It can be used for solder

If you deal with indium, this is a book for you. “Phase Diagrams of Indium Alloys and Their Engineering Applications” has information about pure indium and indium

Diagram of Solder-Dipping Test Apparatus Solder-wetting Curve Interesting question from a Power Semiconductor customer this week about how to test solder paste for use in Power die-attach

Folks, Recently I caught up with Ed Briggs, a member of Indium Corporation's technical staff. I asked Ed if he would share with us his thoughts on "graping" and how to minimize it. His

Liquid thermal interface materials are available in two forms: The major difference between the two is in the temperature which these alloys become molten. Liquid metals remain molten at room

Indium Foil used as a thermal interface can easily be handled with pick and place tools. Never worked with indium foil and wondering, "What's all the hype about?" In many ways, indium

How hot are you setting your solder iron for hand soldering using solder wire or preforms? If you are cranking up the solder iron temperature because you have transitioned to lead-free solders, think

ここ数日、私のアプリケーション・エンジニア仲間の一人であるジム・ヒサートが、インジウム接合とインジウム冷間溶接について、彼の半導体ウェブサイトにブログを投稿した。この話題は

I recently visited a customer to help optimize a flux-less indium soldering application. They admitted they needed flux but didn’t know 1) what to use, or 2) if there was a better way to fix

This is the shape of flux deposits left after pin transfer Spheres attached after pin transfer Pin transfer is a way of selectively depositing a semi-solid or liquid material (like a solder paste or

As previously posted, Indiums Table of Specialty Alloys and Solders contains hundreds of solder alloys used as thermal interface materials and for each of them, we have listed melting temperatures.

As previously posted, Indiums Table of Specialty Alloys҂and solderscontains hundreds of solder alloys and for each of them, we have listed melting temperatures. The method by which these were

サーマル・マテリアルのトラブルシューティングや最適化の方法をお探しですか？サーマル・インターフェースを除いたサーマル・スタックアップの性能を判断するために、私たちが考案した方法のひとつです。

Our engineering group recently recieved a personal win when a prospective customer we have been working with for years finally took notice of out Au/Sn advancements and agreed to run a full

Continuing with the topic of thermal interface material options, a popular material choice is a clad metal thermal interface preform including multiple layers of various metals, or a metal preform

Here is a pretty good list of resources on the topic of corrosion, if you’re interested: 1. Chongchen Xu. “Corrosion in Microelectronics“ 2003 2. Charles A. Harper. Electronic

Corrosion is caused by an electrochemical reaction between two dissimilar metals, one acting as an anode – one as a cathode. Halide ions, such as fluoride, bromide, and chloride, are the usual

Corrosion leads to field failures. I could probably stop right there – that’s bad enough. To flesh that out a little more, corrosion can lower thermal and electrical conductivity, cause

腐食に関する4回シリーズの第1回目：1)腐食とは何か、2)腐食が私たちに及ぼす影響、3)腐食の原因と防止策、4)さらに詳しく知る方法。腐食には3つの基本がある

When considering the choice of flux for preforms, in addition to factoring in the amount of flux required on a preform, the type of flux is also important. Fluxes are categorized using the