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Au/Sn (Everyone’s Best Friend)

Our engineering group recently recieved a personal win when a prospective customer we have been working with for years finally took notice of out Au/Sn advancements and agreed to run a full

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Clad Thermal Interface Materials

Continuing with the topic of thermal interface material options, a popular material choice is a clad metal thermal interface preform including multiple layers of various metals, or a metal preform

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Corrosion – Part 4, Learn More

Here is a pretty good list of resources on the topic of corrosion, if you’re interested: 1. Chongchen Xu. “Corrosion in Microelectronics“ 2003 2. Charles A. Harper. Electronic

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Corrosion - Partie 3, Sources et prévention

Corrosion is caused by an electrochemical reaction between two dissimilar metals, one acting as an anode – one as a cathode. Halide ions, such as fluoride, bromide, and chloride, are the usual

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Corrosion - Partie 2, comment elle nous affecte

Corrosion leads to field failures. I could probably stop right there – that’s bad enough. To flesh that out a little more, corrosion can lower thermal and electrical conductivity, cause

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Corrosion - Partie 1, ce que c'est

Cet article est le premier d'une série de quatre articles sur la corrosion : 1) ce qu'est la corrosion, 2) comment elle nous affecte, 3) les sources de corrosion et la prévention, et 4) comment en savoir plus. La corrosion se présente sous 3 formes principales

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Types de flux pour préformes

When considering the choice of flux for preforms, in addition to factoring in the amount of flux required on a preform, the type of flux is also important. Fluxes are categorized using the

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SAC305 May Not Become De-Facto Standard

Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. With the increased need for shock resistance in

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Are There Even Better Performing Thermal Interface Materials available Than Metal?

Multiple times I have discussed the intrinsic properties of metal thermal interface materials which make them the top performer on the market today. With thermal conductivities of 86W/mK, there is

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Why Invest in a Great Thermal Interface Material?

There are some applications which can function fine with grease at the thermal interface or even with no thermal interface material at all. This was the case for most electronics of the

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Soldering to Stainless Steel

Have you ever had that sinking feeling when you tried soldering to stainless steel and found it to be very draining? You can join stainless steel, you know, and here's how! You need the correct

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Sans halogène ou sans halogénure

There is a significant push in the electronics industry to produce “halogen-free” products in order to be more environmentally friendly. The industry has begun to adopt the definition of

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Package-on-Package Component Dipping (2/5)

Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surface of the flux reservoir. You can check this by

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Au/Sn – One of a Kind

For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if you don’t factor cost into it). Although the cost of the

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Contrôlez vos matériaux, ou ils vous contrôleront (partie 1)

Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are

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Dépose de pâte à braser Die-Attach

L'image montre un "kit de composants d'application". Je trouve que ce kit est extrêmement utile pour vérifier rapidement votre combinaison poudre/aiguille. Ce kit particulier est fabriqué par EFD. En tant que

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Questions à Tim Jensen

Folks, Tim Jensen, Product Manager, PCB Assembly Materials, would surely be considered one of the most knowledgeable people in lead-free soldering and solder materials. I was able to catch up with

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Comprendre les problèmes de fluage sur un empilement de diodes.

Le mot "fluage" n'est pas quelque chose qu'un ingénieur souhaite entendre lorsqu'il conçoit un TIM métallique dans son empilement de diodes laser. Mais le fluage est-il vraiment un problème, et le comprenons-nous vraiment lorsque nous parlons de fluage ?

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Indium Oxide Layer

There are multiple types of thermal interface materials available, but due to its high thermal conductivity, compressibility, and ease of application, indium metal is one of the most desired thermal

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S'appuyer sur les données

Folks, I was recently asked to give a presentation and audit an assembly line regarding minimizing "tombstoning" of passives at a major electronic

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01005 Passives Pas vraiment 01005 en taille

Folks, I mentioned this in the quiz at the left, but am I the only one that didn't know that a 01005 passive is really not that size? The designation 01005 means that the passive should be 0.010

Chez Indium, nous recherchons, développons et fabriquons des matériaux d'assemblage électroniques avancés pour répondre aux défis d'aujourd'hui, de demain et de l'avenir.