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Our engineering group recently recieved a personal win when a prospective customer we have been working with for years finally took notice of out Au/Sn advancements and agreed to run a full

Continuing with the topic of thermal interface material options, a popular material choice is a clad metal thermal interface preform including multiple layers of various metals, or a metal preform

Here is a pretty good list of resources on the topic of corrosion, if you’re interested: 1. Chongchen Xu. “Corrosion in Microelectronics“ 2003 2. Charles A. Harper. Electronic

Corrosion is caused by an electrochemical reaction between two dissimilar metals, one acting as an anode – one as a cathode. Halide ions, such as fluoride, bromide, and chloride, are the usual

Corrosion leads to field failures. I could probably stop right there – that’s bad enough. To flesh that out a little more, corrosion can lower thermal and electrical conductivity, cause

부식에 관한 4부작 시리즈 중 첫 번째 글입니다: 1) 부식의 정의, 2) 부식이 우리에게 미치는 영향, 3) 부식의 원인 및 예방, 4) 자세히 알아보는 방법. 부식은 기본적으로 3가지로 나뉩니다.

When considering the choice of flux for preforms, in addition to factoring in the amount of flux required on a preform, the type of flux is also important. Fluxes are categorized using the

Folks, About two years ago it appeared that SAC305 (3.0% silver, 0.5% Cu, the balance tin) was becoming the de-facto standard for Pb-Free assembly. With the increased need for shock resistance in

Multiple times I have discussed the intrinsic properties of metal thermal interface materials which make them the top performer on the market today. With thermal conductivities of 86W/mK, there is

There are some applications which can function fine with grease at the thermal interface or even with no thermal interface material at all. This was the case for most electronics of the

Have you ever had that sinking feeling when you tried soldering to stainless steel and found it to be very draining? You can join stainless steel, you know, and here's how! You need the correct

There is a significant push in the electronics industry to produce “halogen-free” products in order to be more environmentally friendly. The industry has begun to adopt the definition of

Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surface of the flux reservoir. You can check this by

For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if you don’t factor cost into it). Although the cost of the

Package-on-Package solder paste is a relatively new concept in the solder industry. With limited material sets, we need to be able to capitalize on the flexibility of the few solder pastes that are

사진은 "디스펜싱 구성품 키트"를 보여줍니다. 파우더/니들 조합을 빠르게 확인하는 데 매우 유용합니다. 이 특정 키트는 EFD에서 제작했습니다. As

Folks, Tim Jensen, Product Manager, PCB Assembly Materials, would surely be considered one of the most knowledgeable people in lead-free soldering and solder materials. I was able to catch up with

레이저 다이오드 스택에 금속 TIM을 설계할 때 엔지니어가 크리프라는 단어를 듣고 싶지 않을 것입니다. 하지만 크리프가 정말 문제가 될까요, 그리고 크리프를 제대로 이해하고 있을까요?

There are multiple types of thermal interface materials available, but due to its high thermal conductivity, compressibility, and ease of application, indium metal is one of the most desired thermal

Folks, I was recently asked to give a presentation and audit an assembly line regarding minimizing "tombstoning" of passives at a major electronic

Folks, I mentioned this in the quiz at the left, but am I the only one that didn't know that a 01005 passive is really not that size? The designation 01005 means that the passive should be 0.010