Indium Corporation Vice President of Technology Dr. Ning-Cheng Lee will teach a professional development course at the Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Florida, May 31-June 3, 2011.
Dr. Lee’s topic, Achieving High Reliability of Lead-Free Soldering – Materials Consideration, will cover the detailed material considerations required for achieving high reliability for lead-free solder joints, including joint mechanical properties, development of the type and extent of intermetallic compounds under a variety of material combinations and aging conditions, and the effect on reliability. There will be an emphasis on understanding how the various factors contribute to the failure modes, and how to select proper solder alloys and surface finishes for achieving high reliability.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
For more information about ECTC, visit www.ectc.net.
Indium Corporation è uno dei principali fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti comprendono saldature, preforme e flussanti; brasature; bersagli sputter; prodotti chimici e approvvigionamento di indio, gallio e germanio e Reactive NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
