Indium Corporation Vice President of Technology Dr. Ning-Cheng Lee will teach a professional development course at the Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Florida, May 31-June 3, 2011.
Dr. Lee’s topic, Achieving High Reliability of Lead-Free Soldering – Materials Consideration, will cover the detailed material considerations required for achieving high reliability for lead-free solder joints, including joint mechanical properties, development of the type and extent of intermetallic compounds under a variety of material combinations and aging conditions, and the effect on reliability. There will be an emphasis on understanding how the various factors contribute to the failure modes, and how to select proper solder alloys and surface finishes for achieving high reliability.
李博士是世界知名的焊接专家，也是SMTA的杰出会员。他在高温聚合物、微电子封装材料、底部填充材料和粘合剂的研发方面拥有丰富的经验。他目前的研究兴趣涵盖用于电子和应用互连及封装先进材料，重点兼顾高性能与总体成本低。
For more information about ECTC, visit www.ectc.net.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料供应商。 产品包括焊料、焊片助焊剂；硬钎焊；溅射靶材；铟、镓（Ga）和锗的化学品及采购服务；以及Reactive NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、新加坡、韩国、英国和美国设有工厂。
如需了解有关铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至[email protected]。
