Indium Corporation Vice President of Technology Dr. Ning-Cheng Lee will teach a professional development course at the Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Florida, May 31-June 3, 2011.
Dr. Lee’s topic, Achieving High Reliability of Lead-Free Soldering – Materials Consideration, will cover the detailed material considerations required for achieving high reliability for lead-free solder joints, including joint mechanical properties, development of the type and extent of intermetallic compounds under a variety of material combinations and aging conditions, and the effect on reliability. There will be an emphasis on understanding how the various factors contribute to the failure modes, and how to select proper solder alloys and surface finishes for achieving high reliability.
Lee 博士是世界知名的焊接专家，也是 SMTA 的杰出会员。他在高温聚合物、微电子封装材料、填充物和粘合剂的开发方面拥有丰富的经验。他目前的研究兴趣涵盖电子和光电应用领域中用于互连和封装的先进材料，重点是高性能和低成本。
For more information about ECTC, visit www.ectc.net.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
