Semiconductor Solder Pastes
Fine Powder Solder Pastes
Indium Corporation’s fine powder solder pastes are expertly designed to address the growing demands of miniaturization in the electronics industry. Suitable for a variety of applications, including printing, contact dispensing, and jetting, these pastes are specifically formulated to cater to unique customer requirements. Special attention during flux and powder production ensures that the final product is optimized to effectively tackle manufacturing challenges and increase yields.
Powered by Indium Corporation
- High-Quality Powder for High Yield
- Excellent Wetting on Various Substrates
- Covers Printing, Jetting, and Dispensing
Product Overview
Excellent Powder Manufacturability
Indium Corporation’s fine solder powders (Type 6, Type 7, and Type 8) are produced with a particle size distribution that meets IPC standards, ensuring minimal fines and excess particles. Special care during the manufacturing process optimizes the powder’s smoothness and sphericity, resulting in high production yields and minimal defects—particularly on thin substrates that are prone to warpage.
Excellent Flux Capability
The flux used in our fine-powder solder pastes undergo additional proprietary manufacturing steps to ensure high production yields in advanced packaging. This includes the elimination of fine flux impurities that could disrupt the printing process, as well as the inclusion of robust oxidation barriers to prevent further oxidation of the solder powder.
Quick Facts
Fine Powder Solder Pastes Products
- Applied by printing or jetting
- Reflow in inert atmosphere (typically <100 ppm 02 level)
- Compatible with SnAgCu, SnAg, SnSb, or other common Pb-free alloys
- Available in Type 5, Type 6, Type 7, and Type 8 powder size for fine-feature applications
| Flux Type* | Flux Application Method | Description | Cleaning Method | Halogen-Free | Material |
|---|---|---|---|---|---|
| WS | Printing | Best all-around pure water-soluble paste | Warm DI water | Yes | SiPaste® 3.2HF |
| C | Printing | Good wetting power and HIP mitigation | DI water + sapanifier or semi-aqueous chemistry | Yes | SiPaste® C201HF |
| NC | Printing | Best-in-class transfer efficiency and stencil life Best all-around fine feature paste | DI water + sapanifier or semi-aqueous chemistry | Yes | SiPaste® C312HF |
| NC-ULR | Printing | No-clean, ultra-low residue process that is compatible with post-reflow underfill | No-clean | Yes | SiPaste® SMQ77 |
| WS | Jetting | For dot jetting of 300 μm diameter and above, and fine-line dispensing for metallid-attach | Warm DI water | Yes | PicoShot® WS-5M |
| NC | Jetting | For dot jetting of 300 μm diameter and above, and fine-line dispensing for metallid-attach | Solvent- or aqueous-based chemistry or no-clean | Yes | PicoShot® NC-5M PicoShot® NC-6M |
| NC | Jetting | For dot jetting down to 80 μm diameter and above, and fine-line dispensing for metallid-attach | Solvent- or aqueous-based chemistry or no-clean | Yes | Indium12.8HF |
Product Data Sheets
SiPaste® 3.2HF Pb-Free Water-Sol Solder Paste for SiP Designs PDS 99821 R1.pdf
SiPaste® C201HF Solder Paste PDS 99863 (A4) R5.pdf
SnPb PicoShot® NC-5M PDS 100016 R5.pdf
SiPaste® 3.2HF Pb-Free Water-Sol Solder Paste for SiP Designs PDS 99821 (A4) R1.pdf
Related Applications
Fine Powder Pastes can be used in a variety of applications.
2.5D & 3D Packaging
Techniques to incorporate multiple dies in a single
SiP & Heterogeneous Integration Assembly (HIA)
System-in-package (SiP) and heterogeneous integration solutions
Related Markets
Indium Corporation’s Fine Powder Pastes are applicable for use in many markets.
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