Pressure Sintering
InFORCE®
Indium Corporation’s InFORCE® Series of pressure sinter paste materials are available in Silver (Ag) and Copper (Cu), making InFORCE® the ideal solution for die-attach in power modules for demanding applications such as inverters used in EVs, charging stations and renewable energy. These materials deliver exceptional reliability and thermal efficiency, ideal for demanding applications like EV inverter and charger modules.
Powered by Indium Corporation
- Optimal Printing and Dry Placement
- High Metal Load
- Suited for Wide Band Gap Semiconductors
Product Overview
Thermal and Mechanical Reliability
InFORCE® sinter pastes provide low porosity, high-reliability die-attach interconnects. Expected die shear strength exceeds 50MPa, even after thermal cycling/thermal shock reliability test.
High Metal Load, Low Organic Content
InFORCE® sinter pastes are made with a higher metal content than other pressure sinter pastes, offering less material volume loss during processing. Process times can be shortened, especially drying, and the wet-to-post sintered bondline thickness (BLT) variability is minimal. Reduction in BLT from wet to post sintered is approximately 50%.
Quick Facts
Sintering for die-attachment in power electronics has become a standard process, particularly in EV inverter applications utilizing SiC semiconductors. InFORCE® sinter pastes provide material advantages from Ag or Cu interconnects while also enhancing process benefits.
InFORCE® Products
Designed for power electronics die-attach applications, these materials are also being considered for package attachment in power modules, enabling direct bonding to coolers or heat-sinks.
InFORCE®MF
InFORCE®29
| Product Name | Material | Metal Content | Application |
|---|---|---|---|
| InFORCE®MF | Silver (Ag) | 91% | Die-attach, dry placement |
| InFORCE®29 | Copper (Cu) | 86% | Die-attach, dry placement |
Product Data Sheets
InFORCE™MF Pressure-Assisted Ag Sinter Paste for Die-Attach PDS 100320 (A4) R0.pdf
InFORCE™MF Pressure-Assisted Ag Sinter Paste for Die-Attach PDS 100320 R0.pdf
Related Applications
The InFORCE® Series of products are suitable for a variety of applications.
Die-Attach
Die-attach solutions include solder pastes to gold-based
Package-Attach
Wide selections to address the challenges in
Thermal Management
Thermal solutions for HPC ensuring reliability and optimal
Related Markets
InFORCE® sinter pastes are primarily designed for the EV market, targeting power electronics in inverter and charging applications. Pressure sintering for die-attach is rapidly becoming the preferred process, particularly in applications utilizing SiC semiconductors.
Related Products
Reinforced Preforms
InFORMS® reinforced solder preforms enhance joint reliability and
AuLTRA® ThInFORMS®
AuLTRA® ThInFORMS®: Ideal preform for die-attach, enhancing thermal
Heat-Spring®
A renowned soft metal alloy thermal interface
Durafuse® HT
High-temperature Pb-free solder paste alloy Durafuse®
Expert Support for Reliable Results
Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!
Interconnect Reliability: From the Chip to the System
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,
Minimizing Graping
Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to
Reinforced Solder Preforms for High-Reliability and Low Voiding | Technology Advancement
This is the second in a series of blog posts that talks about Reinforced Solder Preforms for High–Reliability and Low Voiding. This post will focus on the technology advancement of InFORMS®
Introduction Natural Limitations of Solder Joint Performance in High-Power Applications
As promised, here are some excerpts from a paper that I co-authored with my colleagues, Tim Jensen and Sunny Neoh. Tim recently presented this paper at SMTA PanPac. The paper discusses how
PanPac is a great opportunity to learn more about new technologies!
Winter is upon us, especially here in the Northeast
Solder Redefined
Considering the relentless push for higher power densities, coupled with increased cycling, a lot is being asked of insulated-gate bipolar transistors (IGBTs). Hybrid electric vehicles, green energy,
Indium Corporation…We Are Everywhere!
The Indium Corporation marcom department has compiled the list of trade shows in which we will have a presence in 2016. It isn't complete yet, and it is still quite large! The location of a trade
The Rule of 3/N for Estimating Field Failure Rates
Folks, It looks like Patty is a bit troubled……. When she was younger, Patty was always annoyed by cranky old people, and now she was worrying that she might become one. The trigger that
Industry’s FIRST B2B Online Video Ads
I am proud to say that INDIUM's Marcom team has achieved another first. This week we unleashed the electronics assembly materials industry's FIRST video ads. Online. B2B. Video is nothing new
Looking for Safety Data Sheets?
Access everything you need — from technical specifications to application guidance — in one convenient location.
Your Success
is Our Goal
Optimize your processes with the latest materials, technology, and expert application support. It all starts by connecting with our team.