压力烧结
InFORCE®
Indium Corporation’s InFORCE® Series of pressure sinter paste materials are available in Silver (Ag) and Copper (Cu), making InFORCE® the ideal solution for die-attach in power modules for demanding applications such as inverters used in EVs, charging stations and renewable energy. These materials deliver exceptional reliability and thermal efficiency, ideal for demanding applications like EV inverter and charger modules.
技术支持：铟泰公司
- 最佳印刷和干燥放置
- High Metal Load
- 适用于宽带隙半导体
产品概览
Thermal and Mechanical Reliability
InFORCE® sinter pastes provide low porosity, high-reliability die-attach interconnects. Expected die shear strength exceeds 50MPa, even after thermal cycling/thermal shock reliability test.
High Metal Load, Low Organic Content
InFORCE® sinter pastes are made with a higher metal content than other pressure sinter pastes, offering less material volume loss during processing. Process times can be shortened, especially drying, and the wet-to-post sintered bondline thickness (BLT) variability is minimal. Reduction in BLT from wet to post sintered is approximately 50%.
概况
Sintering for die-attachment in power electronics has become a standard process, particularly in EV inverter applications utilizing SiC semiconductors. InFORCE® sinter pastes provide material advantages from Ag or Cu interconnects while also enhancing process benefits.
InFORCE® 产品
Designed for power electronics die-attach applications, these materials are also being considered for package attachment in power modules, enabling direct bonding to coolers or heat-sinks.
InFORCE®中频
InFORCE®29
| 产品名称 | 材料 | 金属含量 | 应用 |
|---|---|---|---|
| InFORCE®MF | 银 (Ag) | 91% | Die-attach, dry placement |
| InFORCE®29 | 铜 (Cu) | 85-87% | Die-attach, dry placement |
产品数据表
InFORCE®MF Pressure-Assisted Ag Sinter Paste for Die-Attach PDS 100320 R1.pdf
相关应用
The InFORCE® Series of products are suitable for a variety of applications.
相关市场
InFORCE® sinter pastes are primarily designed for the EV market, targeting power electronics in inverter and charging applications. Pressure sintering for die-attach is rapidly becoming the preferred process, particularly in applications utilizing SiC semiconductors.
相关产品
增强型焊片
InFORMS® 增强型焊片 焊点的可靠性
AuLTRA® ThInFORMS®
AuLTRA® ThInFORMS®：适用于芯片的理想预成型件，可提升……
热泉
A renowned soft metal alloy thermal interface…
Durafuse®HT
高温无铅焊膏合金 HT。
专家支持，结果可靠
您有技术问题或销售咨询吗？我们的专业团队随时为您提供帮助。From One Engineer to Another®不仅是我们的一句口号，更是我们致力于提供卓越服务的承诺。只要您需要，我们随时待命。让我们联系吧！
寻找安全数据表？
您所需的一切——从技术规格到应用 ——都可在此一站式获取。
您的成功
是我们的目标
借助最新的材料、技术以及专家应用 优化您的生产流程。一切都始于与我们团队的联系。