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Thermal Interface Materials
Thermal interface materials (TIMs)—such as TIM1, TIM1.5, or TIM2—play a crucial role in overall system performance. Metal-based TIMs offer the lowest thermal resistance, meet industry reliability standards, and can be customized to suit specific package or system requirements. As the foremost provider of metal-based TIM solutions, Indium Corporation is ready to help you integrate these materials into your products and applications.
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Thermal Interface Materials Overview
Solder TIM Solutions
Solder TIMs (sTIM) are reflowed forming an intermetallic bond between the surfaces, offering the lowest contact resistance available. We have a high bulk thermal conductivity (86 W/m-K), which means less sensitivity to bondline thickness and coplanarity issues compared to polymeric TIMs.
Compressible (Non-Reflow) TIMs
Ideal for TIM1.5, TIM2, and burn-in and test applications, our patented Heat-Spring® provides a compressible metal-based TIM solution without requiring reflow. Its performance closely rivals that of Solder TIM.
Our Heat-Spring® solutions will not dissolve in single and two-phase immersion cooling fluids and the TIM of choice by leading OEMs for immersion cooling data centers.
Liquid Metal TIMs
Gallium-based liquid metals, which are used in the most demanding applications, offer 100% wetting and do not require backside metallization. We’re backed by a strong network of equipment suppliers, superior product knowledge, experience in high-volume applications, and 60+ years of supplying Gallium-based alloys.
Phase-Change Metal Alloy TIM
Phase-change TIMs are initially applied in a solid state, but the heat from the source transforms them into liquid metal. We offer several gallium-free alloys that change phase at temperatures between 60°C and 80°C.
Features
86 W-m/K
Indium’s high bulk thermal conductivity (86 W/m-K) ensures less sensitivity to bond line thickness and coplanarity issues compared to polymer-based TIMs. Unlike graphite TIMs, which struggle with Z-axis heat transfer, metal-based TIMs deliver superior conductivity in all directions
.02 cm2-C/W
Metal TIMs minimize thermal contact resistance through high surface wetting and, combined with their high bulk conductivity, deliver lower overall thermal resistance.
Long-Term Reliability
Metal-based TIMs have been trusted for decades for their performance and ability to withstand standard reliability tests like TC, TS, HAST, and HTOL.
Compliant
Indium is a soft metal, six times softer than pure lead, and anneals at room temperature, allowing it to accommodate thermal expansion with minimal interface stress.
Thermal Interface Material Products
Metal-based TIMs flow and wet to most surfaces, have high isotropic thermal conductivity in all planes, and will not pump-out or bake-out. Metal TIMs offer low yield and flow strengths, enabling the TIM to conform to both surface roughness imperfections as well as warpage due to CTE mismatch. This results in overall low thermal resistance (Rth).
Solder TIMs
Solder TIM solutions offer superior reliability and thermal
Compressible TIMs
Compressible TIMs for top thermal performance and low
Liquid Metal and Liquid Metal Paste
Liquid metals that are RoHS-compliant and
Related Applications
Immersion Cooling
A technique on the rise for thermal
TIM1, TIM1.5, TIM2
Metal-based TIMs deliver high thermal performance and
Burn-in & Test
Burn-in test solutions with soft metal alloys for improved
Thermal Management
Thermal solutions for HPC ensuring reliability and optimal
Related Markets
High-performance metal TIMs have been used for decades in numerous markets that require advanced packaging, which presents unique thermal dissipation challenges.
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Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!
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