In recent days, one of my fellow applications engineers, Jim Hisert posted a blog on his semiconductor website about indium bonding and indium cold welding. This is a topic that comes up often both in the semiconductor world as well as the thermal interface material world.
In semiconductors, I believe the most common application for the indium bonding process is cold welding low temperature indium flip chip bumps to an indium substrate. In the thermal interface material world I commonly discuss this topic with engineers who want to use it to achieve a void-free, high reliable thermal interface material and solder TIMs are out of the question because these require the use of a flux.
For more information on the topic of indium bonding and indium cold welding, read through Jim's blog.