Sintering is a technique that bonds pure metal particles with an organic binder through the application of heat. This process causes the metal particles to fuse both with each other and with the surfaces they contact. There are two primary sintering methods: pressured and pressureless. In electronics assembly, silver (Ag) and copper (Cu) are frequently utilized, with copper emerging as a key material and technology. Indium Corporation offers silver and copper sinter pastes with exceptional thermal and electrical conductivity, enabling device operation at temperatures exceeding 175°C and providing superior reliability compared to solder.
Indium Corporation provides a range of sinter pastes tailored for various applications. The InFORCE® series is optimized for pressure sintering, while the InBAKE™ series is ideal for traditional pressureless sintering. For fast, small-area sintering, the QuickSinter® series delivers exceptional performance, ensuring rapid and efficient results.
Sintering techniques and materials are widely used in the power electronics industry for packaging and assembly, as well as in markets like automotive and e-mobility.
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