Newsroom

Newsroom Archives - 2023

Welcome to Indium Corporation's newsroom archives. Here you will find Indium Corporation's global communications activities, as well as our media interviews.
Indium Corporation Announces Updates to Global Supply Chain Management Team news photo
Indium Corporation Announces Updates to Global Supply Chain Management Team
November 29, 2023
Indium Corporation is pleased to announce several key hires and promotions within its global Supply Chain Management team to ensure the efficient and timely delivery of materials for its customers. Markus Roas has joined the company as Business Unit Manager, Metals and Alexa Hornstein has been promoted to the role of Global Logistics & Trade Compliance Manager. Additionally, Michelle Rounsville and Stephen Swancott have been promoted to the positions of Strategic Sourcing Buyer and Global Logistics Specialist, respectively. 
Indium Corporation Honored with Two Global Technology Awards at Productronica news photo
Indium Corporation Honored with Two Global Technology Awards at Productronica
November 15, 2023
Indium Corporation was honored with two prestigious GLOBAL Technology Awards during an awards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK™, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months. 
Indium Corporation Introduces New Package-Attach Solder Preform Technology at Productronica news photo
Indium Corporation Introduces New Package-Attach Solder Preform Technology at Productronica
November 7, 2023
Indium Corporation® is proud to introduce a novel alloy technology that enables lower processing temperatures in preform soldering, at Productronica 2023, November 14-17, in Munich, Germany. Specifically developed for power module package-attach applications, Indalloy®301-LT is a bismuth-free alloy that prevents thermal defects in the module without sacrificing reliability like traditional bismuth-containing, low-temperature alloys. 
Indium Corporation Expert Receives SMTA Technical Distinction Award news photo
Indium Corporation Expert Receives SMTA Technical Distinction Award
October 11, 2023
Indium Corporation R&D Manager of the Alloy Group and Principal Research Metallurgist Dr. HongWen Zhang was presented with SMTA's prestigious Technical Distinction Award during an awards ceremony on October 9 at SMTA International in Minneapolis, MN. The Technical Distinction Award recognizes individuals who have made significant and continuing technical contributions to SMTA over a period of at least three years.
Indium Corporation to Showcase Innovative Solutions for Thermal Management and Power Electronics at SEMICON Taiwan news photo
Indium Corporation to Showcase Innovative Solutions for Thermal Management and Power Electronics at SEMICON Taiwan
August 23, 2023
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7. 
Indium Corporation to Host Live EV Webcast with Ford VP news photo
Indium Corporation to Host Live EV Webcast with Ford VP
August 22, 2023
In a special episode of Indium Corporation's free webcast series EV InSIDER Live, co-hosts Brian O'Leary and Loren McDonald will interview Darren Palmer, Vice President, Electric Vehicle Programs, Ford Model e, on the floor of The Detroit Auto Show. This unique session, titled How Ford is Driving the EV Revolution: An Exclusive Interview, will be broadcast live via LinkedIn on September 14, 11:30 a.m. EDT.
Indium Corporation’s Dr. Ronald Lasky to Conduct Three-Part Series on Defeating Defects in Electronics Assembly news photo
Indium Corporation’s Dr. Ronald Lasky to Conduct Three-Part Series on Defeating Defects in Electronics Assembly
August 15, 2023
Indium Corporation Senior Technologist Dr. Ronald Lasky will host a three-part webinar series, Defeating Defects in Electronics Assembly (SMT Process), as part of the company's free InSIDER Series. Part I will be held on September 12 at 10 a.m. EDT. Parts two and three will be held at the same time on October 17 and November 14, respectively.
Indium Corporation Experts to Present at SMTA China East Technical Conference news photo
Indium Corporation Experts to Present at SMTA China East Technical Conference
June 29, 2023
The upcoming SMTA China East Technical Conference will feature presentations by four Indium Corporation experts. The conference, which takes place July 19-20, is being held in conjunction with NEPCON China at the Shanghai World Expo Exhibition & Convention Center. In addition to presenting, Senior Area Technical Manager – East China Leo Hu will serve as Conference Chairman for the July 20 sessions. 
Indium Corporation to Feature Products for HIA and SiP at CHIPcon news photo
Indium Corporation to Feature Products for HIA and SiP at CHIPcon
June 20, 2023
As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation® will feature innovative products designed to meet the evolving challenges of HIA and SiP at the Chiplet and Heterogeneous Integration Packaging Conference and Exhibition (CHIPcon) hosted by IMAPS, July 24-27, in San Jose, CA. 
Indium Corporation to Sponsor, Moderate IPC e-Mobility Webinar Series news photo
Indium Corporation to Sponsor, Moderate IPC e-Mobility Webinar Series
May 24, 2023
Indium Corporation is proud to sponsor the four-part e-Mobility Electronics Hardware Reliability Webinar Series,hosted by IPC and moderated by Brian O'Leary, the company's Global Head of e-Mobility and Infrastructure and Chair of the IPC e-Mobility Quality & Reliability Advisory Council. The webinar series will bring together industry leaders to discuss the hurdles in achieving reliability for emerging e-Mobility technology. Reliability drivers, technology applications, and target lifecycles will be examined. 
Indium Corporation’s Dr. Ronald Lasky to Conduct Workshops on Lean Six Sigma for Electronics Assembly news photo
Indium Corporation’s Dr. Ronald Lasky to Conduct Workshops on Lean Six Sigma for Electronics Assembly
May 18, 2023
Indium Corporation senior technologist Dr. Ronald Lasky has been tapped by SMTA to conduct a three-part workshop, titled Solving Real-Life Problems Using the Tools of Lean Six Sigma, in conjunction with Jim Hall, Principal SMT Consultant with ITM Consulting. The first session will be held on May 31 at 3 p.m. EDT. Parts two and three will be held at the same time on June 7 and June 21, respectively. All sessions will be conducted virtually. 
Indium Corporation to Feature Innovative Materials for Power Electronics at PCIM news photo
Indium Corporation to Feature Innovative Materials for Power Electronics at PCIM
April 25, 2023
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, May 9-11, in Nuremberg, Germany. Indium Corporation's products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.
Indium Corporation Joins European Center for Power Electronics  news photo
Indium Corporation Joins European Center for Power Electronics
April 13, 2023
Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the European Center for Power Electronics (ECPE), the leading industrial and research network for power electronics in Europe. Through its involvement with the organization, Indium Corporation continues to position itself as a premier materials provider, as well as thought leader, in the European power electronics market. 
Indium Corporation’s Jenny Gallery to Present at HiTEC news photo
Indium Corporation’s Jenny Gallery to Present at HiTEC
April 4, 2023
Indium Corporation's senior product specialist Jenny Gallery will deliver a presentation at the International Conference and Exhibition on High Temperature Electronics (HiTEC), hosted by IMAPS, in Albuquerque, New Mexico. The presentation, scheduled for April 20, will cover the findings from a technical paper titled AuSn Preform Thickness's Effect on Thermal Management in Semiconductor Laser Applications.
Indium Corporation’s Sze Pei Lim to Present at ICEP Japan news photo
Indium Corporation’s Sze Pei Lim to Present at ICEP Japan
March 30, 2023
Indium Corporation's Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in Kumamoto, Japan, on April 19. The presentation will cover the findings from a technical paper, co-authored by R&D Manager for the Alloy Group HongWen Zhang, titled An In-Containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305.
Indium Corporation Set to Launch Second Season of EV InSIDER Live Webcast Series news photo
Indium Corporation Set to Launch Second Season of EV InSIDER Live Webcast Series
March 29, 2023
Following a successful inaugural season which included six episodes and five high-profile guests from the EV industry, Indium Corporation's EV InSIDER Live webcast series is set to launch its second season on April 13. EV InSIDER Liveis co-hosted by Indium Corporation's global head of e-Mobility and infrastructure, Brian O'Leary, and Loren McDonald, EV consultant and CEO of EVAdoption
Indium Corporation to Feature Gold Products at HiTEC news photo
Indium Corporation to Feature Gold Products at HiTEC
March 28, 2023
As one of the industry's foremost providers of Au-based products, Indium Corporation® will proudly feature its high-temperature and high-reliability gold solder solutions at the International Conference and Exhibition on High Temperature Electronics (HiTEC), hosted by IMAPS, in Albuquerque, New Mexico, April 18-20. Among its featured Au-based products, Indium Corporation will showcase its AuLTRA™ ThInFORMS0.00035" thick (0.00889mm or 8.89μm) 80Au/20Sn preforms.
Indium Corporation’s Brian O’Leary to Participate in Panel Workshop at The Assembly Show South news photo
Indium Corporation’s Brian O’Leary to Participate in Panel Workshop at The Assembly Show South
March 22, 2023
Indium Corporation's Brian O'Leary, global head of e-Mobility and infrastructure, will present as part of a panel workshop at The Assembly Show South, on April 4, in Nashville, Tennessee. Scheduled for 1:30-4:30 p.m., the workshop is titled Vehicle Electrification and U.S. Manufacturing: Building the EV While We Drive It. O'Leary will be joined on the panel by Debbie Carboni (KYZEN Corporation), Brian Chislea (Dow Chemical Company), and Dwight Howard (formerly with APTIV LPC). 
Indium Corporation’s Brian O’Leary to Present at EV Charging Infrastructure USA 2023 news photo
Indium Corporation’s Brian O’Leary to Present at EV Charging Infrastructure USA 2023
March 15, 2023
Indium Corporation's Brian O'Leary, global head of e-Mobility and infrastructure, will present at EV Charging Infrastructure USA 2023. The event, which will take place March 29–30 in Anaheim, CA, is the only event of its kind to deliver leading market intelligence and industry presentations on the latest EV charging infrastructure projects to support the expansion of electric vehicles. 
Indium Corporation Joins American Semiconductor Innovation Coalition to Advance U.S. Leadership in Technology Supply Chains news photo
Indium Corporation Joins American Semiconductor Innovation Coalition to Advance U.S. Leadership in Technology Supply Chains
March 14, 2023
Advanced materials innovator Indium Corporation today announced they have joined the American Semiconductor Innovation Coalition (ASIC). ASIC recently expanded its membership to include representatives from all stages of the chip fabrication supply chain, including packaging (interconnection and protection of the semiconductor chip). Indium Corporation will be joining fellow technology innovators focused on advancing U.S. leadership in the research and development of semiconductor technology. 
Two Indium Corporation Experts to Present at APEC  news photo
Two Indium Corporation Experts to Present at APEC
March 8, 2023
Two Indium Corporation experts are set to present at APEC 2023, March 19-23, in Orlando, FL. Senior Research Chemist Dr. Sihai Chen will present a technical poster titled Highly Reliable Silver Sintering Joints for Power Module Applications, while Product Manager Joe Hertline will deliver a presentation titled A Novel Material Technology that Reduces Tooling Dependency and Process Complexity in Power Module Soldering and Sintering Applications.  
Indium Corporation to Feature Products for HIA and SiP at IMAPS Device Packaging Conference news photo
Indium Corporation to Feature Products for HIA and SiP at IMAPS Device Packaging Conference
March 7, 2023
As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation® will feature innovative products designed to meet the evolving challenges of SiP and HIA at the 19th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 13‒16, in Fountain Hills, AZ. 
Two Indium Corporation Experts to Participate at IMAPS Device Packaging Conference news photo
Two Indium Corporation Experts to Participate at IMAPS Device Packaging Conference
March 1, 2023
The upcoming 19th International Conference and Exhibition on Device Packaging, hosted by IMAPS on March 13-16 in Fountain Hills, AZ, will include participation by two Indium Corporation experts. Product Manager (Semiconductor) Dean Payne will deliver a presentation on pressure copper sinter paste for die-attach in power electronics devices while Dr. Andy Mackie, Principal Engineer and Manager for Thermal Interface Materials Applications, is set to chair a special invited session. 
Indium Corporation Engineers Achieve 100% SMTA Certification and Historic High Score news photo
Indium Corporation Engineers Achieve 100% SMTA Certification and Historic High Score
February 23, 2023
Indium Corporation is proud to continue its legacy of producing the highest quality technical support engineers, benefitting both its global customer base as well as the surface mount technology (SMT) industry. This legacy is evidenced by its current tally of 36 SMTA (Surface Mount Technology Association) certified employees as well as the impressive accomplishment of Technical Engineer Carson Burt, who recently achieved a score of 98%—the highest in SMTA history—while earning his SMTA CSMTPE (certified surface mount technology process engineer) certification. 
Indium Corporation to Host Webinar on Material Technology for Power Module Soldering and Sintering news photo
Indium Corporation to Host Webinar on Material Technology for Power Module Soldering and Sintering
February 7, 2023
Indium Corporation's Joe Hertline, Product Manager for Engineered Solder Materials (ESM)/Power Electronics, will host a webinar to discuss an emerging material technology which has the ability to provide robust tacking strength while reducing dependency on customized fixturing. The webinar, a part of the company's InSIDER Series, will be held live at 8:30 a.m. (EST), Tuesday, February 28 and made available for on-demand viewing afterward. 
Indium Corporation to Participate at 3D-PEIM, Feature Innovative Products for Power Electronics news photo
Indium Corporation to Participate at 3D-PEIM, Feature Innovative Products for Power Electronics
January 25, 2023
Indium Corporation® will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), February 1‒3 in Miami, Florida. In addition, Indium Corporation’s Principal Engineer and Manager for the Thermal Interface Materials Applications, Dr. Andy Mackie, will chair a technical session on interconnects and lead attachments on February 2.