Applications
MEMS Assembly
In semiconductor packaging, Micro-Electro-Mechanical Systems (MEMS) devices are often integrated to enhance electronic systems with sensing and actuation capabilities. These compact, integrated units are widely used across numerous applications and markets. Ensuring high-quality assembly of MEMS devices is crucial for the performance and reliability of the final product. Indium Corporation offers a range of products designed to effectively meet these assembly needs.
Overview
Achieve Precision, Protection, and Performance in MEMS
Packaging MEMS devices poses challenges in securing enclosures, lid seals, and mechanical stability. Precise electrical and mechanical integration is essential, and innovative soldering materials, like solder paste and flux, are key to ensuring reliability. We provide materials and expertise to address precision, protection, sealing, and performance needs for MEMS.
MEMs Assembly Products
Indium Corporation’s materials and expertise help eliminate defects in the design of the materials to reduce blow holes or solder creep.
Fine Powder Pastes
Semiconductor Solder Pastes Fine Powder Solder Pastes Indium Corporation’s fine powder solder pastes are expertly designed to address the growing demands of miniaturization in the electronics
Solder Spheres
Select specialty semiconductor solder spheres ranging in
Semiconductor Fluxes
Extensive portfolio of proven and new semiconductor
Alloys
Our alloy innovation with hundreds of specialized
AuLTRA® ThInFORMS®
AuLTRA® ThInFORMS®: Ideal preform for die-attach, enhancing thermal
AuLTRA® Precision Die-Attach Preforms
Gold-based PDA preforms deliver top-notch precision &
Gold-Alloy Ribbon
Durable, high-performance gold-alloy ribbon for precision
Related Applications
Semiconductor Packaging & Assembly
Critical semiconductor packaging ensures functionality and
SiP & Heterogeneous Integration Assembly (HIA)
System-in-package (SiP) and heterogeneous integration solutions
Related Markets
MEMS are used in a variety of applications, including automotive systems, consumer electronics, medical devices, and industrial equipment.
ML/AI in Semiconductor Packaging and Electronics Manufacturing
As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing. Often, challenges in precision die
Ultralow Residue Flip-Chip Fluxes: Semicon Taiwan
It’s often helpful to overhear good things being said about you. I attended a supplier meeting in Los Angeles in March, and overheard two senior engineers discussing no-clean fluxes. “Who
Effect of Package and Die Size on Dipping and Pick-up
While in South East Asia last summer, Indium's technical team and I had a chance to discuss flip-chip dipping processes with a major equipment
Solder Paste for Low Temperature and Pb-Free Applications
There are a lot of parameters to consider when choosing the right solder for your application: 1) The operational temperature of the final device 2) The metallizations that you are soldering to 3)
Unique Solderspheres
Solderspheres or solder spheres, or even solder balls: whatever you call them, Indium Corporation has been making them for years and has rightly acquired the reputation for doing whatever it takes to
Turning the World of Blogging Upside-Down
Indium Corporation’s industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium Corporation’s Semicon West exhibit, booth #7834,
Meet My Fellow Indium Bloggers at Semicon West
Folks, Indium Corporation's industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium Corporation's Semicon West exhibit, booth
Meet the Bloggers!
Indium Corporation's industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium Corporation's Semicon West exhibit, booth #7834, from
Meet the Bloggers
Indium Corporations industry leading semiconductor bloggers are hosting a Meet the Bloggers session on Tuesday, July 15, 2008 at Indium CorporationҒs Semicon West exhibit, booth #7834, from 2-3pm
Your Success
is Our Goal
Optimize your processes with the latest materials, technology, and expert application support. It all starts by connecting with our team.