Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, delivered a keynote presentation at the Electronics Packaging Symposium at Binghamton University on Oct. 8. Indium Corporation's Dr. Weiping Liu, research metallurgist, also presented at the symposium.
Dr. Lee's keynote presentation, Prospects of Potential 3D and 2.5D Package Interconnect Materials, discussed a variety of considerations for selecting appropriate materials packaging including shape, joint resistance, bonding, and stability.
Dr. Liu's presentation, Performance of SACm0510 Solder Alloy for Mobile Electronics Applications, discussed a new soldering alloy doped with Mn, and its improvements versus other solders on the market.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
Liu received his Ph.D. in materials science and engineering from the Harbin Institute of Technology, China. Subsequently, he performed postdoctoral work at the Technical University of Berlin, Germany. Liu was a professor at the Dailan Jiatong University in China and a visiting scientist at the Max-Planck Institute for Metals Research in Stuttgart, Germany. He was affiliated with the Joining and Welding Research Institute (JWRI) in Osaka University, Japan, and was part of the Materials Science and Engineering Department at Lehigh University, Pa.
The Electronics Packaging Symposium focused on promising new technologies and developments that are impacting the electronics industry. Participants received overviews and research reports on a range of emerging technologies, including national trends, embedded electronics, thermal challenges, 3D packaging, sensors and MEMs, flexible electronics, high-temperature electronics, mobile electronics, and printed electronics and additive manufacturing.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, de l'énergie solaire, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, Indium dispose d'une assistance technique mondiale et d'usines situées en Chine, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
