Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, delivered a keynote presentation at the Electronics Packaging Symposium at Binghamton University on Oct. 8. Indium Corporation's Dr. Weiping Liu, research metallurgist, also presented at the symposium.
Dr. Lee's keynote presentation, Prospects of Potential 3D and 2.5D Package Interconnect Materials, discussed a variety of considerations for selecting appropriate materials packaging including shape, joint resistance, bonding, and stability.
Dr. Liu's presentation, Performance of SACm0510 Solder Alloy for Mobile Electronics Applications, discussed a new soldering alloy doped with Mn, and its improvements versus other solders on the market.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
Liu received his Ph.D. in materials science and engineering from the Harbin Institute of Technology, China. Subsequently, he performed postdoctoral work at the Technical University of Berlin, Germany. Liu was a professor at the Dailan Jiatong University in China and a visiting scientist at the Max-Planck Institute for Metals Research in Stuttgart, Germany. He was affiliated with the Joining and Welding Research Institute (JWRI) in Osaka University, Japan, and was part of the Materials Science and Engineering Department at Lehigh University, Pa.
The Electronics Packaging Symposium focused on promising new technologies and developments that are impacting the electronics industry. Participants received overviews and research reports on a range of emerging technologies, including national trends, embedded electronics, thermal challenges, 3D packaging, sensors and MEMs, flexible electronics, high-temperature electronics, mobile electronics, and printed electronics and additive manufacturing.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
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