Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, delivered a keynote presentation at the Electronics Packaging Symposium at Binghamton University on Oct. 8. Indium Corporation's Dr. Weiping Liu, research metallurgist, also presented at the symposium.
Dr. Lee's keynote presentation, Prospects of Potential 3D and 2.5D Package Interconnect Materials, discussed a variety of considerations for selecting appropriate materials packaging including shape, joint resistance, bonding, and stability.
Dr. Liu's presentation, Performance of SACm0510 Solder Alloy for Mobile Electronics Applications, discussed a new soldering alloy doped with Mn, and its improvements versus other solders on the market.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
Liu received his Ph.D. in materials science and engineering from the Harbin Institute of Technology, China. Subsequently, he performed postdoctoral work at the Technical University of Berlin, Germany. Liu was a professor at the Dailan Jiatong University in China and a visiting scientist at the Max-Planck Institute for Metals Research in Stuttgart, Germany. He was affiliated with the Joining and Welding Research Institute (JWRI) in Osaka University, Japan, and was part of the Materials Science and Engineering Department at Lehigh University, Pa.
The Electronics Packaging Symposium focused on promising new technologies and developments that are impacting the electronics industry. Participants received overviews and research reports on a range of emerging technologies, including national trends, embedded electronics, thermal challenges, 3D packaging, sensors and MEMs, flexible electronics, high-temperature electronics, mobile electronics, and printed electronics and additive manufacturing.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Solar-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
Weitere Informationen über die Indium Corporation erhalten Sie unter www.indium.com oder per E-Mail an [email protected].
