Indium Corporation expert Graham Wilson, Applications Engineer, will present at the Advanced Electronics Assembly Conference (AEAC) in two locations—first on November 19 in Budapest, Hungary, then on November 21 in Oradea, Romania.
At both conferences, Wilson will present Automotive-Grade Solder Paste—How to Engineer Flux Chemistry to Achieve High SIR and Maximize Print & Reflow Process Windows. Automotive electrification and automation trends, such as 48V, HEV, and EV electrification, infotainment platforms, and advanced driver assist platforms (ADAS), demand significant challenges for no-clean solder paste flux chemistry. Wilson will examine engineering no-clean halogen-free fluxes to achieve high electrical reliability and prevent dendritic growth under high-power, low-standoff components for enhanced SIR conditions. The no-clean halogen-free fluxes will also have to achieve high SPI yields with print deviation <10% for small apertures, and provide solutions for common industry challenges such head-in-pillow and voiding.
Wilson is an Applications Engineer for Indium Corporation’s European operations. He provides comprehensive technical advice in the selection, use, and application of solder paste, flux, and engineered solders to customers in electronics assembly, optoelectronics, thermal management, semiconductor packaging, and related industries. Wilson has more than 20 years of experience spanning a number of industries, including a focus on electronics assembly and thermal management. He is certified as a Six Sigma Green Belt through the Thayer School of Engineering at Dartmouth and shares his expertise at conferences internationally. Wilson earned his degree in HNC Electronics from the University of Northampton.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, l'entreprise dispose d'une assistance technique mondiale et d'usines situées en Chine, en Inde, en Malaisie, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, visitez le site www.indium.com ou envoyez un courriel à [email protected]. Vous pouvez également suivre nos experts, From One Engineer To Another® (#FOETA), sur www.facebook.com/indium ou @IndiumCorp.
