Ir al contenido

Indium Corporation Expert to Present at Advanced Electronics Assembly Conference 2019

Indium Corporation expert Graham Wilson, Applications Engineer, will present at the Advanced Electronics Assembly Conference (AEAC) in two locations—first on November 19 in Budapest, Hungary, then on November 21 in Oradea, Romania.

At both conferences, Wilson will present Automotive-Grade Solder Paste—How to Engineer Flux Chemistry to Achieve High SIR and Maximize Print & Reflow Process Windows. Automotive electrification and automation trends, such as 48V, HEV, and EV electrification, infotainment platforms, and advanced driver assist platforms (ADAS), demand significant challenges for no-clean solder paste flux chemistry. Wilson will examine engineering no-clean halogen-free fluxes to achieve high electrical reliability and prevent dendritic growth under high-power, low-standoff components for enhanced SIR conditions. The no-clean halogen-free fluxes will also have to achieve high SPI yields with print deviation <10% for small apertures, and provide solutions for common industry challenges such head-in-pillow and voiding.

Wilson is an Applications Engineer for Indium Corporation’s European operations. He provides comprehensive technical advice in the selection, use, and application of solder paste, flux, and engineered solders to customers in electronics assembly, optoelectronics, thermal management, semiconductor packaging, and related industries. Wilson has more than 20 years of experience spanning a number of industries, including a focus on electronics assembly and thermal management. He is certified as a Six Sigma Green Belt through the Thayer School of Engineering at Dartmouth and shares his expertise at conferences internationally. Wilson earned his degree in HNC Electronics from the University of Northampton.

Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, las películas finas y la gestión térmica. Sus productos incluyen soldaduras y fundentes, soldaduras fuertes, materiales de interfaz térmica, cátodos para sputtering, metales y compuestos inorgánicos de indio, galio, germanio y estaño, y NanoFoil®. Fundada en 1934, la empresa cuenta con asistencia técnica mundial y fábricas en China, India, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.

Para más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a [email protected]. También puede seguir a nuestros expertos, From One Engineer To Another® (#FOETA), en www.facebook.com/indium o @IndiumCorp.