Indium Corporation expert Graham Wilson, Applications Engineer, will present at the Advanced Electronics Assembly Conference (AEAC) in two locations—first on November 19 in Budapest, Hungary, then on November 21 in Oradea, Romania.
At both conferences, Wilson will present Automotive-Grade Solder Paste—How to Engineer Flux Chemistry to Achieve High SIR and Maximize Print & Reflow Process Windows. Automotive electrification and automation trends, such as 48V, HEV, and EV electrification, infotainment platforms, and advanced driver assist platforms (ADAS), demand significant challenges for no-clean solder paste flux chemistry. Wilson will examine engineering no-clean halogen-free fluxes to achieve high electrical reliability and prevent dendritic growth under high-power, low-standoff components for enhanced SIR conditions. The no-clean halogen-free fluxes will also have to achieve high SPI yields with print deviation <10% for small apertures, and provide solutions for common industry challenges such head-in-pillow and voiding.
Wilson is an Applications Engineer for Indium Corporation’s European operations. He provides comprehensive technical advice in the selection, use, and application of solder paste, flux, and engineered solders to customers in electronics assembly, optoelectronics, thermal management, semiconductor packaging, and related industries. Wilson has more than 20 years of experience spanning a number of industries, including a focus on electronics assembly and thermal management. He is certified as a Six Sigma Green Belt through the Thayer School of Engineering at Dartmouth and shares his expertise at conferences internationally. Wilson earned his degree in HNC Electronics from the University of Northampton.
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。公司成立于 1934 年，拥有全球技术支持，在中国、印度、马来西亚、新加坡、韩国、英国和美国均设有工厂。
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