Indium Corporation experts will present technical findings at IPC Midwest Conference & Exhibition, September 21-22, 2011, in Schaumburg, Illinois.
Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present Thermal Pad Design at QFN Assembly for Voiding Control, which analyzes and presents the effects of variables on voiding.
Indium Corporation’s Senior Technologist, Dr. Ronald C. Lasky, Ph.D., will be presenting Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability. Low silver lead-free alloys have been shown to have superior drop shock performance, but people have questioned whether or not their thermal cycle performance is adequate. This paper will discuss these issues.
Dr. Lasky will also be presenting the tutorial Lead-Free Assembly for High Yields and Reliability, which will provide a framework for discussion of quality, manufacturability and reliability, and for examination of material properties and design parameters. It will also explore options for increasing the reliability of electronics assemblies.
In addition, Dr. Lasky will moderate Minimizing Defects in Assembly Processing.
Le Dr Lee est un expert en brasage de renommée mondiale et un membre de distinction de la SMTA. Il possède une vaste expérience dans le développement de polymères à haute température, d'encapsulants pour la microélectronique, de sous-remplissages et d'adhésifs. Ses recherches actuelles portent sur les matériaux avancés pour les interconnexions et l'emballage pour les applications électroniques et optoélectroniques, en mettant l'accent sur la haute performance et le faible coût de possession.
Dr. Lasky has more than 30 years experience in electronic and optoelectronic packaging and assembly, including work at IBM, Universal Instruments and Cookson Electronics. He has authored or edited five books on science, electronics, and optoelectronics, as well as several technical papers and articles for Scientific American. Dr. Lasky holds numerous patent disclosures and is the developer of several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization. He is the co-creator of engineering certification exams in electronics assembly and is the director of Dartmouth’s Six Sigma Program. Dr. Lasky was awarded the SMTA Founder’s Award in 2003. He also authors a technology blog which can be found at blogs.indium.com/blog/an-interview-with-the-professor.
For more information about IPC Midwest, visit www.ipcmidwestshow.org.
Indium Corporation est un fournisseur de matériaux de premier plan pour les marchés mondiaux de l'électronique, des semi-conducteurs, de l'énergie solaire, des couches minces et de la gestion thermique. Ses produits comprennent des soudures, des préformes et des flux, des brasures, des cibles de pulvérisation, des produits chimiques et des sources d'approvisionnement en indium, gallium et germanium, ainsi que Reactive NanoFoil®. Fondée en 1934, Indium dispose d'une assistance technique mondiale et d'usines situées en Chine, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
