Indium Corporation experts will present technical findings at IPC Midwest Conference & Exhibition, September 21-22, 2011, in Schaumburg, Illinois.
Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present Thermal Pad Design at QFN Assembly for Voiding Control, which analyzes and presents the effects of variables on voiding.
Indium Corporation’s Senior Technologist, Dr. Ronald C. Lasky, Ph.D., will be presenting Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability. Low silver lead-free alloys have been shown to have superior drop shock performance, but people have questioned whether or not their thermal cycle performance is adequate. This paper will discuss these issues.
Dr. Lasky will also be presenting the tutorial Lead-Free Assembly for High Yields and Reliability, which will provide a framework for discussion of quality, manufacturability and reliability, and for examination of material properties and design parameters. It will also explore options for increasing the reliability of electronics assemblies.
In addition, Dr. Lasky will moderate Minimizing Defects in Assembly Processing.
El Dr. Lee es un experto en soldadura de renombre mundial y miembro distinguido de la SMTA. Tiene una amplia experiencia en el desarrollo de polímeros de alta temperatura, encapsulantes para microelectrónica, rellenos y adhesivos. Sus intereses de investigación actuales abarcan los materiales avanzados para interconexiones y envasado para aplicaciones electrónicas y optoelectrónicas, con énfasis tanto en el alto rendimiento como en el bajo coste de propiedad.
Dr. Lasky has more than 30 years experience in electronic and optoelectronic packaging and assembly, including work at IBM, Universal Instruments and Cookson Electronics. He has authored or edited five books on science, electronics, and optoelectronics, as well as several technical papers and articles for Scientific American. Dr. Lasky holds numerous patent disclosures and is the developer of several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization. He is the co-creator of engineering certification exams in electronics assembly and is the director of Dartmouth’s Six Sigma Program. Dr. Lasky was awarded the SMTA Founder’s Award in 2003. He also authors a technology blog which can be found at blogs.indium.com/blog/an-interview-with-the-professor.
For more information about IPC Midwest, visit www.ipcmidwestshow.org.
Indium Corporation es uno de los principales proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, las películas finas y la gestión térmica. Sus productos incluyen soldaduras, preformas y fundentes; soldaduras fuertes; cátodos para sputter; productos químicos y abastecimiento de indio, galio y germanio; y Reactive NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
