Indium Corporation experts will present technical findings at IPC Midwest Conference & Exhibition, September 21-22, 2011, in Schaumburg, Illinois.
Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present Thermal Pad Design at QFN Assembly for Voiding Control, which analyzes and presents the effects of variables on voiding.
Indium Corporation’s Senior Technologist, Dr. Ronald C. Lasky, Ph.D., will be presenting Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability. Low silver lead-free alloys have been shown to have superior drop shock performance, but people have questioned whether or not their thermal cycle performance is adequate. This paper will discuss these issues.
Dr. Lasky will also be presenting the tutorial Lead-Free Assembly for High Yields and Reliability, which will provide a framework for discussion of quality, manufacturability and reliability, and for examination of material properties and design parameters. It will also explore options for increasing the reliability of electronics assemblies.
In addition, Dr. Lasky will moderate Minimizing Defects in Assembly Processing.
リー博士は世界的に著名なはんだ付けの専門家であり、SMTAの特別会員でもある。高温ポリマー、マイクロエレクトロニクス用封止材、アンダーフィル、接着剤の開発に豊富な経験を持つ。現在の研究テーマは、エレクトロニクスおよびオプトエレクトロニクス用途の相互接続およびパッケージング用の先端材料で、高性能と低所有コストの両方に重点を置いている。
Dr. Lasky has more than 30 years experience in electronic and optoelectronic packaging and assembly, including work at IBM, Universal Instruments and Cookson Electronics. He has authored or edited five books on science, electronics, and optoelectronics, as well as several technical papers and articles for Scientific American. Dr. Lasky holds numerous patent disclosures and is the developer of several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization. He is the co-creator of engineering certification exams in electronics assembly and is the director of Dartmouth’s Six Sigma Program. Dr. Lasky was awarded the SMTA Founder’s Award in 2003. He also authors a technology blog which can be found at blogs.indium.com/blog/an-interview-with-the-professor.
For more information about IPC Midwest, visit www.ipcmidwestshow.org.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、太陽電池、薄膜、熱管理市場向けの一流材料サプライヤーです。製品には、はんだ、プリフォーム、フラックス、ろう材、スパッタターゲット、インジウム、ガリウム、ゲルマニウムの化学薬品および調達、Reactive NanoFoil®などがある。1934年に設立されたインジウムは、グローバルな技術サポートと中国、シンガポール、韓国、英国、米国に工場を有しています。
インジウム・コーポレーションに関する詳細については、indiumstg.wpenginepowered.comをご覧いただくか、[email protected] までメールでお問い合わせください。
