CLINTON, N.Y., September 1, 2026 — With a team of manufacturing and technical experts supporting customers across India, Indium Corporation will feature its portfolio of high-performance solder pastes, lower-cost, low-silver solder alloys, and thermal interface materials solutions at Productronica India, September 16-18, in Bengaluru, India.
L'entreprise présentera les produits suivants :
- Durafuse® Technology is a patented solder paste alloy system that delivers breakthrough performance in solder joint quality and reliability in complex designs. Trusted across industrial applications, it achieves exceptional reliability at lower processing temperatures—reducing your carbon footprint and improving process yields.
- Durafuse® LT is a low-temperature alloy ideal for large BGA assemblies prone to temperature-induced warpage, uneven PCB heating during reflow, or assemblies with temperature-sensitive components. It reduces peak reflow temperatures while exhibiting superior thermal cycling and drop-shock performance.
- Durafuse® HR delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding control for high-reliability automotive and mobile infrastructure applications.
- Indium12.9HF is a no-clean, halogen-free solder paste specifically formulated to accommodate fine-feature printing, as seen with 01005 and 008004 components. It offers unprecedented stencil print-transfer efficiency to work in the broadest range of processes to boost SPI yields. Indium12.9HF also delivers low voiding at BGA, CSP, LGA, and QFN, and high oxidation resistance without graping or solder balling on pads as small as 175 microns in air reflow.
- Indium10.1HF is an air-reflow, no-clean, halogen- and Pb-free solder paste specifically formulated to have ultra-low voiding, especially for designs that incorporate large ground pads. Its flux chemistry improves reliability by minimizing voiding and maximizing ECM and Head-in-Pillow (HIP) performance while also providing excellent wetting, solder beading, solder balling, and slump.
- Indium10.8HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.
To learn more about Indium Corporation’s high-reliability thermal management and low-silver alloy solutions, visit indium.com or meet our company experts at Productronica India 2026, Booth H4.B81.
À propos d'Indium Corporation
IndiumCorporation® est l'un des principaux raffineurs, fondeurs, fabricants et fournisseurs de matériaux destinés aux marchés mondiaux de l'électronique, des semi-conducteurs, des couches minces et de la gestion thermique. Sa gamme de produits comprend des soudures et des flux ; des alliages de brasage ; des matériaux d'interface thermique ; des cibles de pulvérisation ; de l'indium, du gallium, du germanium et de l'étain sous forme de métaux et de composés inorganiques ; ainsi quele NanoFoil®. Fondée en 1934, la société dispose d'un service d'assistance technique mondial et d'usines situées en Chine, en Allemagne, en Inde, en Malaisie, au Mexique, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
Pour plus d'informations sur Indium Corporation, rendez-vous sur https://www.indium.com/ ou envoyez un e-mail à [email protected]. Vous pouvez également suivre nos experts, « From One Engineer ToAnother® » (#FOETA), sur www.linkedin.com/company/indium-corporation/.
