CLINTON, N.Y., September 1, 2026 — With a team of manufacturing and technical experts supporting customers across India, Indium Corporation will feature its portfolio of high-performance solder pastes, lower-cost, low-silver solder alloys, and thermal interface materials solutions at Productronica India, September 16-18, in Bengaluru, India.
同社は以下の製品を展示する予定です：
- Durafuse® Technology is a patented solder paste alloy system that delivers breakthrough performance in solder joint quality and reliability in complex designs. Trusted across industrial applications, it achieves exceptional reliability at lower processing temperatures—reducing your carbon footprint and improving process yields.
- Durafuse® LT is a low-temperature alloy ideal for large BGA assemblies prone to temperature-induced warpage, uneven PCB heating during reflow, or assemblies with temperature-sensitive components. It reduces peak reflow temperatures while exhibiting superior thermal cycling and drop-shock performance.
- Durafuse® HR delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding control for high-reliability automotive and mobile infrastructure applications.
- Indium12.9HF is a no-clean, halogen-free solder paste specifically formulated to accommodate fine-feature printing, as seen with 01005 and 008004 components. It offers unprecedented stencil print-transfer efficiency to work in the broadest range of processes to boost SPI yields. Indium12.9HF also delivers low voiding at BGA, CSP, LGA, and QFN, and high oxidation resistance without graping or solder balling on pads as small as 175 microns in air reflow.
- Indium10.1HF is an air-reflow, no-clean, halogen- and Pb-free solder paste specifically formulated to have ultra-low voiding, especially for designs that incorporate large ground pads. Its flux chemistry improves reliability by minimizing voiding and maximizing ECM and Head-in-Pillow (HIP) performance while also providing excellent wetting, solder beading, solder balling, and slump.
- Indium10.8HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.
To learn more about Indium Corporation’s high-reliability thermal management and low-silver alloy solutions, visit indium.com or meet our company experts at Productronica India 2026, Booth H4.B81.
インジウム・コーポレーションについて
インジウム・コーポレーション®は、世界のエレクトロニクス、半導体、薄膜、および熱管理市場向けに、素材の精製、製錬、製造、供給を行うトップクラスの企業です。 製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズなどの金属および無機化合物、ならびにNanoFoil®が含まれます。1934年に設立された同社は、世界的な技術サポート体制を整備しており、中国、ドイツ、インド、マレーシア、メキシコ、シンガポール、韓国、英国、米国に工場を構えています。
インジウム・コーポレーションに関する詳細については、https://www.indium.com/をご覧いただくか、[email protected] までメールでお問い合わせください。また、www.linkedin.com/company/indium-corporation/ で、当社の専門家による「From One Engineer ToAnother®（#FOETA）」をフォローすることもできます。
