Sintering Materials

A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has has surged, highlighting Cu sintering's suitability for various

Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

In recent years, silver sinter materials have grown in popularity in power module assembly, especially for die attach. When compared to traditional solders, silver sinter offers numerous benefits

One of the most unique features of any sintering material, including our QuickSinter® material, is that it does not need to reach or remain above a liquidus temperature like traditional solder.