Indium 5.7LT-1 is engineered with a balanced set of properties for outstanding printing and soldering, including:
- Low-temperature reflow
- Clear post-reflow flux residue
- High transfer efficiency and low variation
- Excellent response-to-pause
- Low-voiding in bottom termination components (QFNs), BGAs, LGAs
- Excellent wetting
Indium5.7LT-1 is halogen-free per EN14582 test method. It joins Indium Corporation’s versatile high-performance, low-voiding solder pastes designed to accommodate a variety of industry requirements with lead-free, halogen-free, and no-clean options.
For more information about Indium Corporation’s suite of low-voiding solder pastes, visit www.indium.com/avoidthevoid.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, target per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
