Indium Corporation Launches New Low-Temperature Solder Paste

Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for low-temperature assembly processes using indium and bismuth alloys.

Indium 5.7LT-1 is engineered with a balanced set of properties for outstanding printing and soldering, including:

• Low-temperature reflow
• Clear post-reflow flux residue
• High transfer efficiency and low variation
• Excellent response-to-pause
• Low-voiding in bottom termination components (QFNs), BGAs, LGAs
• 優異的潤濕性

Indium5.7LT-1 is halogen-free per EN14582 test method. It joins Indium Corporation’s versatile high-performance, low-voiding solder pastes designed to accommodate a variety of industry requirements with lead-free, halogen-free, and no-clean options.

For more information about Indium Corporation’s suite of low-voiding solder pastes, visit www.indium.com/avoidthevoid.

Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil^®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。

For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.facebook.com/indium or @IndiumCorp.