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Indium Corporation Launches New Low-Temperature Solder Paste

Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for low-temperature assembly processes using indium and bismuth alloys.

Indium 5.7LT-1 is engineered with a balanced set of properties for outstanding printing and soldering, including:

  • Low-temperature reflow
  • Clear post-reflow flux residue
  • High transfer efficiency and low variation
  • Excellent response-to-pause
  • Low-voiding in bottom termination components (QFNs), BGAs, LGAs
  • 탁월한 습윤성

Indium5.7LT-1 is halogen-free per EN14582 test method. It joins Indium Corporation’s versatile high-performance, low-voiding solder pastes designed to accommodate a variety of industry requirements with lead-free, halogen-free, and no-clean options.

For more information about Indium Corporation’s suite of low-voiding solder pastes, visit indiumstg.wpenginepowered.com/avoidthevoid.

Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.

For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.