Indium Corporation Launches New Low-Temperature Solder Paste

Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for low-temperature assembly processes using indium and bismuth alloys.

Indium 5.7LT-1 is engineered with a balanced set of properties for outstanding printing and soldering, including:

• Low-temperature reflow
• Clear post-reflow flux residue
• High transfer efficiency and low variation
• Excellent response-to-pause
• Low-voiding in bottom termination components (QFNs), BGAs, LGAs
• 優れた濡れ性

Indium5.7LT-1 is halogen-free per EN14582 test method. It joins Indium Corporation’s versatile high-performance, low-voiding solder pastes designed to accommodate a variety of industry requirements with lead-free, halogen-free, and no-clean options.

For more information about Indium Corporation’s suite of low-voiding solder pastes, visit www.indium.com/avoidthevoid.

インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、^NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。

For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.facebook.com/indium or @IndiumCorp.