Indium Corporation Launches New Low-Temperature Solder Paste

Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for low-temperature assembly processes using indium and bismuth alloys.

Indium 5.7LT-1 is engineered with a balanced set of properties for outstanding printing and soldering, including:

• Low-temperature reflow
• Clear post-reflow flux residue
• High transfer efficiency and low variation
• Excellent response-to-pause
• Low-voiding in bottom termination components (QFNs), BGAs, LGAs
• 优异的润湿

Indium5.7LT-1 is halogen-free per EN14582 test method. It joins Indium Corporation’s versatile high-performance, low-voiding solder pastes designed to accommodate a variety of industry requirements with lead-free, halogen-free, and no-clean options.

For more information about Indium Corporation’s suite of low-voiding solder pastes, visit indiumstg.wpenginepowered.com/avoidthevoid.

铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；^{以及NanoFoil®。}该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。

For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.facebook.com/indium or @IndiumCorp.