As one of the leading materials providers to the power electronics assembly industry, Indium Corporation will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany. Indium Corporations products for power electronics have been demonstrated to reduce energy consumption and drive green technologies of tomorrow, such as e-Mobility. These proven materials have also been shown to solve customers warpage issues while ensuring high reliability and improving overall efficiency.
Among its featured products, Indium Corporation will showcase:
- Durafuse HT an innovative Pb-free solution based on a novel alloy technology designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse HT can drop in to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
- Indalloy301 LT Alloy for Preforms/InFORMS a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents delamination and warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS.
- QuickSinter a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. Applications include die-attach and substrate-attach in power electronics. The portfolio includes the InFORCE range of pressure sinter pastes:
- InFORCE29 a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications; InFORCE29 features high workability, making it suitable for printing or dispensing applications.
- InFORCEMF a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications; InFORCEMF is specially formulated for printing applications, providing low process yield loss due to print defects.
- InFORCE LA a pressure silver sinter paste formulated for sintering of areas greater than 100mm2. Sintering is possible with reduced temperatures and pressure, making it suitable for transferring molded package-attach to cooler applications.
To learn more about Indium Corporations solutions for power electronics, be sure to visit with our experts at PCIM in hall 6, stand #466.
Informazioni su Indium Corporation
Indium Corporation è un'azienda leader nella raffinazione, fusione, produzione e fornitura di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil. Fondata nel 1934, l'azienda dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Germania, India, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
