Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present two tutorials at SMT/Hybrid/Packaging exhibition and conference in Nuremberg, Germany, May 3-5, 2011.
The first tutorial, Solder Defects for Advanced SMT Manufacturing – Formation Mechanisms and Troubleshooting, will explore new challenges engineers face with the advancement of the electronics industry and approaches to prevent solder defects.
The second tutorial, Materials Selection for Lead-Free Soldering, covers the detailed material considerations required for lead-free soldering, including how to select proper solder alloys and surface finishes for achieving high reliability.
Indium Corporation is also participating in the exhibition at stand 7-430.
For more information or to register for the conference, visit http://www.mesago.de/en/SMT/home.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
Indium Corporation è uno dei principali fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti comprendono saldature, preforme e flussanti; brasature; bersagli sputter; prodotti chimici e approvvigionamento di indio, gallio e germanio e Reactive NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
