Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present two tutorials at SMT/Hybrid/Packaging exhibition and conference in Nuremberg, Germany, May 3-5, 2011.
The first tutorial, Solder Defects for Advanced SMT Manufacturing – Formation Mechanisms and Troubleshooting, will explore new challenges engineers face with the advancement of the electronics industry and approaches to prevent solder defects.
The second tutorial, Materials Selection for Lead-Free Soldering, covers the detailed material considerations required for lead-free soldering, including how to select proper solder alloys and surface finishes for achieving high reliability.
Indium Corporation is also participating in the exhibition at stand 7-430.
For more information or to register for the conference, visit http://www.mesago.de/en/SMT/home.
李博士是世界知名的焊接专家，也是SMTA的杰出会员。他在高温聚合物、微电子封装材料、底部填充材料和粘合剂的研发方面拥有丰富的经验。他目前的研究兴趣涵盖用于电子和应用互连及封装先进材料，重点兼顾高性能与总体成本低。
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料供应商。 产品包括焊料、焊片助焊剂；硬钎焊；溅射靶材；铟、镓（Ga）和锗的化学品及采购服务；以及Reactive NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、新加坡、韩国、英国和美国设有工厂。
如需了解有关铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至[email protected]。
