Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present two tutorials at SMT/Hybrid/Packaging exhibition and conference in Nuremberg, Germany, May 3-5, 2011.
The first tutorial, Solder Defects for Advanced SMT Manufacturing – Formation Mechanisms and Troubleshooting, will explore new challenges engineers face with the advancement of the electronics industry and approaches to prevent solder defects.
The second tutorial, Materials Selection for Lead-Free Soldering, covers the detailed material considerations required for lead-free soldering, including how to select proper solder alloys and surface finishes for achieving high reliability.
Indium Corporation is also participating in the exhibition at stand 7-430.
For more information or to register for the conference, visit http://www.mesago.de/en/SMT/home.
Lee 博士是世界知名的焊接專家，也是 SMTA 的優秀會員。他在高溫聚合物、微電子封裝材料、底部填充物和粘合劑的開發方面擁有豐富的經驗。他目前的研究興趣涵蓋用於電子和光電應用的互連和封裝的先進材料，強調高性能和低擁有成本。
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料供應商。產品包括焊料、預成型品和助熔劑；钎料；濺鍍靶材；铟、鎵和锗化學品和採購；以及 Reactive NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
