Solder Pastes
Semiconductor Solder Pastes
Indium Corporation is a trusted partner in providing semiconductor solder paste and optimizing its application process. Our diverse selection of semiconductor solder pastes cater to a variety of applications in semiconductor packaging assembly. Our extensive range of solder pastes meets diverse needs in semiconductor packaging assembly, including precision printing, dispensing, and jetting for SIP and MEMS applications. We also provide specialized solutions for die and clip attachment on leadframe or ceramic substrates, tailored for power semiconductor and power module assembly.
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- Complete Portfolio
- Large Selection of Alloys
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Product Overview
As a trusted name in manufacturing, our products are designed to meet your semiconductor packaging requirements. Take advantage of our extensive range of flux chemistries and alloys for optimal performance all while being supported by our experienced technical team.
Partner Qualified
Mycronic has qualified the Picoshot® series for jetting applications. This series includes Type 5 and Type 6 options, both no-clean and water-wash, with further development and qualification in progress.
High-temperature Pb-free
Introducing the Durafuse® HT, a drop-in Pb-free solution for replacing Pb-containing solders in high-temperature applications.
20 Years
Our SMQ75 high-temperature, high-Pb paste, with over 20 years of industry history, continues to be the standard standard for die-attach in lead frame applications.
5 Billion
To date, more than 5 billion front-end SiP modules have been manufactured using Indium Corporation’s semiconductor materials, and we anticipate continued growth.
Semiconductor Solder Paste Products
Indium Corporation offers a comprehensive portfolio that includes standard no-clean and ultra-low-residue no-clean fluxes, water-wash chemistry, and new fluxless technology. Choose from a wide variety of alloys that cover low-, mid-, and high-melting temperatures. Equipped with advanced solder powder manufacturing technology, we produce round, low-oxide powder with precise distribution for optimal performance.
Jetting & Microdispensing Paste
| PicoShot® WS-5M | Water-wash | Yes | Jetting | For dot jetting of 300µm diameter and above, and fine-line dispensing for metal lid-attach |
| PicoShot® NC-5M | Solvent- or aqueous-based chemistry or no-clean | Yes | Jetting | For dot jetting of 230-280µm diameter, and fine-line dispensing for metal lid-attach |
| PicoShot® NC-6M | ||||
| Indium12.8HF | Water-wash | Yes | Jetting and Microdispensing | For dot jetting down to 80µm diameter and above, and fine-line dispensing for metal lid-attach |
| Indium6.6HF-HD | Water-wash | Yes | Jetting and Microdispensing | Water-washable jetting and fine-line dispensing paste |
SiPaste® Solder Paste
| SiPaste® 3.2HF | Water-wash | Yes | Type 6 and Type 7 solder paste suitable for ultrafine-pitch printing | Best all-around pure water-soluble paste |
| SiPaste® C201HF | DI water + saponifier or semi-aqueous chemistry | Yes | Type 6 and Type 7 solder paste suitable for ultrafine-pitch printing | Good wetting power and HiP mitigation |
| SiPaste® C312HF | DI water + saponifier, semi-aqueous chemistry, or no-clean | Yes | Type 6, Type 7, and Type 8 solder paste suitable for ultrafine-pitch printing | Best-in-class transfer efficiency and stencil life; best all-around fine-feature paste |
| SiPaste® SMQ77 | No-clean | Yes | Type 6 solder paste suitable for ultrafine-pitch printing | No-clean, ultra-low residue process that is compatible with post-reflow underfill |
Semiconductor Solder Pastes
Fine Powder Pastes
Semiconductor Solder Pastes Fine Powder Solder Pastes Indium Corporation’s fine powder solder pastes are expertly designed to address the growing demands of miniaturization in the electronics
High-Temperature Solder Pastes
Pb or Pb-free high-temperature solder
PicoShot® Series
Jetting Paste developed with Mycronic for trusted
Related Applications
High-Temperature Soldering
Offering high-temperature soldering materials for critical applications in harsh
Semiconductor Packaging & Assembly
Critical semiconductor packaging ensures functionality and
Related Markets
Related Products
Fine Powder Pastes
Semiconductor Solder Pastes Fine Powder Solder Pastes Indium Corporation’s fine powder solder pastes are expertly designed to address the growing demands of miniaturization in the electronics
High-Temperature Solder Pastes
Pb or Pb-free high-temperature solder
Durafuse® Technology
A patented solder alloy technology to enable complex
Expert Support for Reliable Results
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