Semiconductor Solder Pastes

Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous

As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing. Often, challenges in precision die

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to

Hi All, My team came across an interesting article the other day from IEEE Spectrum that talked about the recent advent of

Hello all, I mentioned in the first blog post that I was excited to document my journey at Indium Corporation; it’s funny to think that most of that documentation has come from quickly

Hello all, As a recent college graduate, I’ve had a number of conversations with my peers about how their new jobs are treating them. When I would eventually ask about if they enjoyed their

Indium Corporation’s Dr. Andy Mackie, Senior Product Manager, Semiconductor and Advanced Assembly Materials, and Sze Pei Lim, Regional Manager, Semiconductor, discuss how different reliability

Seth Homer: As discussed in video one of this four video series, there are three attach levels of peak concern in the IGBT stack up. By redefining how we use solder at the die-attach, DBC Substrate,