CLINTON, N.Y., March 19, 2026 — As a proven leader in soldering materials and metal thermal interface materials (TIMs) solutions for future-forward technologies, Indium Corporation® will showcase its AI-enabling product portfolio at Productronica China, March 25-27, in Shanghai, China.
The company will feature the following products:
- Solder TIMs (sTIMs) deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Optimized for BGA package applications, they enable low-void, high-reliability performance across multiple reflow cycles, ensuring thermal stability. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, sTIMs enhance battery life, reduce cooling fan size, and minimize heat-sink mass while maintaining RoHS compliance and supporting sustainability initiatives.
- Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution through the company’s metals and compounds reclaim and recycle program.
- GalliTHERM® is a portfolio of gallium-based liquid metal solutions built on more than 60 years of expertise in manufacturing advanced gallium materials. Designed for both TIM1 and TIM2 applications, these liquid metal TIMs offer cutting-edge thermal interface performance with superior reliability.
- Liquid Metal TIMs are designed to offer superior thermal conductivity for both TIM1 and TIM1.5 (TIM0) applications. They offer high thermal conductivity to enhance end-product longevity and reliability, low interfacial resistance against most surfaces to dissipate heat quickly, and exceptional wetting ability to both metallic and nonmetallic surfaces. Liquid Metal TIMs are available in a variety of alloys, including InGa and InGaSn.
Additionally, Indium Corporation will also feature its next revolution of solder, including:
- Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that provide energy savings and high reliability in low-temperature step soldering. It is ideal for assemblies with broad temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and can outperform SAC305 with optimal process setup.
- Durafuse® HR is a trusted and proven solder paste alloy technology delivering enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding control for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
To learn more about Indium Corporation’s thermal management solutions, visit indium.com or meet our company experts at Productronica China 2026, booth E4.4100.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit https://www.indium.com/ or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
