Sintering Materials
Pressure Sintering
Pressure sintering is increasingly recognized as the preferred method for die-attach in high-power, high-reliability applications, such as power modules for electric vehicles (EVs). The superior thermal, electrical, and mechanical properties make pressure sintering the preferred process for such demanding applications. Indium Corporation’s pressure sintering materials are engineered with high metal loading to minimize material loss during processing, enabling increased throughput with rapid printing and shorter drying times.
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- High Melting Temperature Interconnects
- High Metal Loading
- Maximized Throughput

Product Overview
High Melting Temperature Interconnects
Silver (Ag) and Copper (Cu) have melting points of 961oC and 1084oC, respectively. When combined with the mechanical strength of sintered Ag or Cu, they offer exceptional fatigue resistance, even at junction temperatures above 175oC.
Superior Thermal Conductivity
Among interconnect solutions, pressure-sintered Ag and Cu provide unparalleled thermal conductivity, with sintered Ag expected to exceed 250W/m.K and Cu surpassing 200W/m.K, depending on joint porosity.
Enhanced Reliability and Durability
Pressure sintering, when compared to traditional Pb-based and Pb-free solders, offers heightened reliability and an extended operational lifespan that’s crucial for demanding applications such as automotive and EV technologies*.
Lower Processing Temperatures
Pressure sintering, conducted at temperatures of 220°C and above, offers a significant advantage over soldering techniques by reducing post-processing substrate warpage.
*EV technologies encompass a range of electric vehicles, including battery electric vehicles (BEV), hybrid electric vehicles (HEV), and plug-in hybrid electric vehicles (PHEV).
Related Applications
Related Markets
Our pressure sintering pastes enable rapid sintering on various surfaces and die metallizations, creating strong joints on standard leadframes, DBC, and IPM pad finishes. They offer a reliable alternative to traditional soldering, particularly for applications and products used in demanding environments.
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