Applications
MEMS Assembly
In semiconductor packaging, Micro-Electro-Mechanical Systems (MEMS) devices are often integrated to enhance electronic systems with sensing and actuation capabilities. These compact, integrated units are widely used across numerous applications and markets. Ensuring high-quality assembly of MEMS devices is crucial for the performance and reliability of the final product. Indium Corporation offers a range of products designed to effectively meet these assembly needs.


Overview
Achieve Precision, Protection, and Performance in MEMS
Packaging MEMS devices poses challenges in securing enclosures, lid seals, and mechanical stability. Precise electrical and mechanical integration is essential, and innovative soldering materials, like solder paste and flux, are key to ensuring reliability. We provide materials and expertise to address precision, protection, sealing, and performance needs for MEMS.
MEMs Assembly Products
Indium Corporation’s materials and expertise help eliminate defects in the design of the materials to reduce blow holes or solder creep.
Fine Powder Pastes
Semiconductor Solder Pastes Fine Powder Solder Pastes Indium Corporation’s fine powder solder pastes are expertly designed to address the growing demands of miniaturization in the electronics
AuLTRA® Precision Die-Attach Preforms
Gold-based precision die-attach preforms deliver top-notch precision &
Related Applications
Semiconductor Packaging & Assembly
Critical semiconductor packaging ensures functionality and
SiP & Heterogeneous Integration Assembly (HIA)
System-in-package (SiP) and heterogeneous integration solutions
Related Markets
MEMS are used in a variety of applications, including automotive systems, consumer electronics, medical devices, and industrial equipment.
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is Our Goal
Optimize your processes with the latest materials, technology, and expert application support. It all starts by connecting with our team.