High-Performance Computing
High-performance computing (HPC) is a driving force behind innovation and efficiency in electronics assembly and semiconductor packaging. It fuels the rapid development of electronic products and systems around the world. Plus, it is essential for developing cutting-edge technologies like artificial intelligence (AI), and machine learning, which rely on sophisticated semiconductor designs and packaging solutions.
Overview
Partner with Indium Corporation for High-Performance Computing Success
From solder pastes and semiconductor fluxes to thermal interface materials, the precise selection, combination, and application of these components are crucial for high production yields and exceptional product quality. Indium Corporation excels in this area, providing technical expertise and service to help customers effectively implement the optimal combinations of materials.
Main Board
- Non-tacky residue with excellent ICT performance
- Excellent HIP and NWO performance
- Excellent conformal coating compatibility
- More than two orders of magnitude better than Bi-containing low-temperature materials
- TCT performance can be better than SAC305
- Added solder volume to improve mechanical reliability
- WF-7745 VOC-free flux
- WF-9945 rosin-containing flux
Memory Module
- Restricted flux residue
- Excellent transfer efficiency
- Improving drop shock resistance
- Improving TCT performance
Graphic Card
- Eliminates HIP and NWO when BGAs warp
- Excellent wetting on different surfaces
Power Device
- Reduce ground pad voiding
- Less flux residue, enhance SIR performance
Connector
- Added solder volume to improve mechanical reliability
Heat Sink
- Compressed between two surfaces without reflow
- High thermal conductivity
- Excellent thermal cycling performance
Related Products
We provide a comprehensive selection of products, including semiconductor fluxes, solder paste, and high-reliability alloys, designed to help customers achieve their unique objectives.
Heat-Spring®
A renowned soft metal alloy thermal interface
Liquid Metal and Liquid Metal Paste
Liquid metals that are RoHS-compliant and
Solder Wire
Premium solder wire with even winding, high purity, and
Thermal Interface Materials
Metal-based TIMs offer low thermal resistance & customizable
Related Applications
PCB Assembly
Proven and cutting-edge materials for PCB assembly
Semiconductor Packaging & Assembly
Critical semiconductor packaging ensures functionality and
Thermal Management
Thermal solutions for HPC ensuring reliability and optimal
Why Indium Corporation
Maximize Your Yield and Potential—Partner With Us Today
As a global leader known for our technical expertise and innovative solutions, we ensure that your products exceed industry standards, offering unmatched performance and reliability. Partner with us to experience cutting-edge technology and exceptional service—the Indium Corporation difference.
Your Success
is Our Goal
Optimize your processes with the latest materials, technology, and expert application support. It all starts by connecting with our team.