Gold-Alloy Preforms
AuLTRA® ThInFORMS®
Indium Corporation’s AuLTRA® ThInFORMS® are the ideal choice for die-attach applications. By utilizing a preform thickness of 0.00035″, the bondline thickness (BLT) is reduced, enhancing thermal transfer from the die to the substrate. This optimization boosts operational performance and efficiency in high-output laser applications. The packaging tailored for automated assembly of these preforms guarantees consistent success in the production process.
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- Reduces Solder Volume and Wicking Up the Die
- Reduces Bondline Thickness (BLT) and Voiding
- Improves Thermal Transfer and Overall Operational Efficiency of the Device
Product Overview
AuLTRA® ThInFORMS® Preform Shapes
Available in square, rectangular, and disc Indalloy®182 preforms with a thickness of 0.00035″. These preforms improve operational efficiency of high-output lasers by reducing voiding, solder volume, and wicking up the die.
Geometry
Guidelines for preform geometry can be derived from the die size. Generally, 90-100% of the die size will indicate the preform x and y dimensions. When it comes to thickness, AuLTRA® ThInFORMS® provide a thinner bondline, improving thermal transfer from die to substrate. The most critical attribute for die bonding application is flatness, but due to process constraints, fixturing can be difficult and time consuming. Allowing the die to float freely on the preform can be advantageous. If the preform is not flat, it can skew the die at reflow and fail, which is why processing is the key to preserving flatness.
Indalloy®182
Indalloy®182 is generally chosen due to its good thermal conductivity; high shear, yield, and tensile strength; excellent wettability; and resistance to corrosion.
Alloys
Indalloy®182 (80Au20Sn) ensures excellent performance and reliability for applications that require a high-melting die-attach solder. Indalloy®182 is typically chosen for its thermal conductivity, high shear yield, tensile strength, wettability, and resistance to corrosion.
Features
With over 200 alloys available, we offer solutions for temperatures up to 1,100°C. We provide alternatives to traditional high-lead options, including novel lead-free solutions such as gold solders, sintering materials, preforms, and alloy technologies integrated with new flux systems.
>280°C
High melting point is compatible with subsequent reflow processes
Critical Applications
Automotive, RF infrastructure, medical, laser, military, and aerospace applications
Pb-free
Lead-free and RoHS compliant
#1 in Reliability
Highest tensile strength of any solder
Product Data Sheets
AuLTRA® ThInFORMS® for Die-Attach Applications PDS 99803 (A4) R1.pdf
AuLTRA® ThInFORMS® for Die-Attach Applications PDS 99803 R1.pdf
Related Applications
AuLTRA® ThInFORMS® are suitable for a variety of applications.
High-Temperature Soldering
Offering high-temperature soldering materials for critical applications in harsh
Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
Die-Attach
Die-attach solutions include solder pastes to gold-based
Related Markets
Indium Corporation is a leading gold solder innovator that provides high-temperature, high-reliability, and critical applications such as die-attach and hermetic sealing to the following areas:
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