金合金預型件
AuLTRA® ThInFORMS®軟體
Indium Corporation’s AuLTRA® ThInFORMS® are the ideal choice for die-attach applications. By utilizing a preform thickness of 0.00035″, the bondline thickness (BLT) is reduced, enhancing thermal transfer from the die to the substrate. This optimization boosts operational performance and efficiency in high-output laser applications. The packaging tailored for automated assembly of these preforms guarantees consistent success in the production process.
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- Reduces Solder Volume and Wicking Up the Die
- Reduces Bondline Thickness (BLT) and Voiding
- Improves Thermal Transfer and Overall Operational Efficiency of the Device
產品總覽
AuLTRA® ThInFORMS® Preform Shapes
Available in square, rectangular, and disc Indalloy®182 preforms with a thickness of 0.00035″. These preforms improve operational efficiency of high-output lasers by reducing voiding, solder volume, and wicking up the die.
幾何學
Guidelines for preform geometry can be derived from the die size. Generally, 90-100% of the die size will indicate the preform x and y dimensions. When it comes to thickness, AuLTRA® ThInFORMS® provide a thinner bondline, improving thermal transfer from die to substrate. The most critical attribute for die bonding application is flatness, but due to process constraints, fixturing can be difficult and time consuming. Allowing the die to float freely on the preform can be advantageous. If the preform is not flat, it can skew the die at reflow and fail, which is why processing is the key to preserving flatness.
合金
Indalloy®182 (80Au20Sn) ensures excellent performance and reliability for applications that require a high-melting die-attach solder. Indalloy®182 is typically chosen for its thermal conductivity, high shear yield, tensile strength, wettability, and resistance to corrosion.
摘要
Indium Corporation’s AuLTRA® ThInFORMS® are an excellent choice for die-attach applications. By using a preform with a thickness of 0.00035″, the BLT is reduced and thermal transfer from the die to the substrate is improved, increasing the operational performance and efficiency of high-output lasers. Packaging designed for automated assembly of these preforms ensures repeatable success in a production process.
特點
With over 200 alloys available, we offer solutions for temperatures up to 1,100°C. We provide alternatives to traditional high-lead options, including novel lead-free solutions such as gold solders, sintering materials, preforms, and alloy technologies integrated with new flux systems.
>280°C
High melting point is compatible with subsequent reflow processes.
關鍵應用
Automotive, RF infrastructure, medical, laser, military, and aerospace applications.
無鉛
Lead-free and RoHS compliant.
#可靠性排名第一
Highest tensile strength of any solder.
產品資料表
用於貼片應用的AuLTRA® ThInFORMS®PDS 99803 R1.pdf
相關應用程式
AuLTRA® ThInFORMS® are suitable for a variety of applications.
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