Solder TIM (sTIM)

Folks, A short time ago, I posted “Metal TIMs 101: Chapter 1” with Jon Major. Now it is time for Chapter 2! Dr. Ron: Jon, what is TIM1.5? Jon: TIM1.5 commonly refers to the interface

Folks, Dr. Ron: For my next several posts, I would like to chat with Indium Corporation’s metal thermal interface materials (TIMs) Product Manager, Jon Major, about metal TIMs. Jon, can you tell us

Advanced packaging has continued to evolve with various interconnect technologies on their way towards heterogeneous

Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to

The 48th International Symposium on Microelectronics (IMAPS) was held in Orlando, FL, USA last month, from October 26th through the 29th, 2015. I was able to attend as both as an exhibitor and as a

The junction temperature in an LED (the p-n junction temperature) is most critical to consider for LED cooling.If this temperature rises above the prescribed level recommended by the LED

Proper solder joints provide mechanical, electrical, and thermal interconnections that are reliable over the course of a product’s lifespan. Unreliable interconnections not only cause product

In recent days, one of my fellow applications engineers, Jim Hisert posted a blog on his semiconductor website about indium bonding and indium cold welding. This is a topic that comes up often both

The process of applying a solder thermal interface material typically includes applying flux to a solder preform and reflowing it in a sandwich between two substrates. When a preform comes flux