Applications
Bump Fusion
In the semiconductor manufacturing process, bump fusion is crucial for forming solder bumps on wafers, enabling the transfer of electrical signals on semiconductor chips. Indium Corporation’s wafer bumping flux reliably produces flawless, oxide-free solder bumps. With a long-standing reputation for quality, we remain a trusted provider of exceptional wafer bumping flux solutions.
Overview
Remove Oxides and Enhance Solderability with Wafer-Bumping Flux
Wafer bumping flux, or bump fusion flux, is low-viscosity material applied via spin-coating onto wafers with solder bumps, copper pillars, or solder-capped surfaces. This specialized flux eliminates oxides and impurities during reflow and cleaning. It transforms irregular, non-spherical, plated, or dented solder bumps on wafers into smooth, oxide-free forms. Available in water-soluble or solvent-based formulations, our wafer bumping fluxes deliver optimal performance by removing oxides, enhancing solderability.
Benefits
Enhanced Bump Fusion: Cleanable, Versatile, Consistent Solutions
Easily Cleanable
The WS-series can be easily cleaned after reflow with warm DI water, while the SC-series allows for effortless cleaning using widely available industrial solvents or aqueous-based solutions.
Wide Selection
Ideal for a broad range of solder alloy bumps, including lead-free and high lead-containing alloys
Consistent
Produces smooth, oxide-free solder bumps across various solder alloys, leveraging precision and expertise in the soldering process
Versatile
Can be applied with printing, jetting, dispensing, and spin-coating on 6-inch to 12-inch wafers
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Related Markets
Bump fusion and wafer bumping flux are widely used in markets for wafer-level packaging markets, which demand precise and reliable methods for creating solder bumps on silicon wafers. Wafer bumping flux is particularly essential in the semiconductor packaging and assembly industry, especially for 2.5D and 3D packaging applications. With years of experience in this field, we recognize the critical importance of precision and expertise in the soldering process.
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