Sintering Materials
Pressureless Sintering
Pressureless sintering is a versatile bonding process used in many applications. Sintered joints offer excellent thermal and electrical conductivity and can withstand high temperatures over 175°C. It’s also a lead-free alternative to traditional die-attach solders. Indium Corporation provides both silver and copper pressureless sinter pastes for reliable performance.
Powered by Indium Corporation
- High Metal/Low Organic Formulations
- Ag and Cu Sinter Options
- Lower Temperature 200°C Sintering (Ag)
Product Overview
Suitable for Various Surface Finishes
Our pressureless silver (Ag) sinter paste is compatible with Ag, gold (Au), and copper (Cu) surfaces, while the Cu sinter paste suits Cu, Au, Ni, and Ag surfaces.
Ideal in High Temperatures
With melting points of 961°C for Ag and 1084°C for Cu, sintering is the perfect solution for applications where operating temperatures may exceed 175°C.
Lead-Free Die Attach Solution
Pressureless sintering offers a lead-free alternative to traditional Pb-based high-temperature solder pastes for semiconductor die attachment.
Low Processing Temperature
Pressureless sintering operates as a function of temperature over time. Indium Corporation’s Ag sinter paste can be processed at temperatures as low as 200°C.
Product Data Sheets
QuickSinter® InBake AgCu- Pressureless Ag Sinter Paste PDS 99969 (A4) R0.pdf
QuickSinter® InBake AgCu- Pressureless Ag Sinter Paste PDS 99969 R0.pdf
Related Applications
Related Markets
Expert Support for Reliable Results
Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!
Looking for Safety Data Sheets?
Access everything you need — from technical specifications to application guidance — in one convenient location.
Your Success
is Our Goal
Optimize your processes with the latest materials, technology, and expert application support. It all starts by connecting with our team.