Substrate / Spacer-Attach

Achieving efficiency, reliability, and exceptional thermal performance is crucial in package-attach soldering applications for power modules. However, the high reflow temperatures required by

A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has has surged, highlighting Cu sintering's suitability for various

In recent years, silver sinter materials have grown in popularity in power module assembly, especially for die attach. When compared to traditional solders, silver sinter offers numerous benefits

Seth Homer: As we've discussed, there are three attach levels of peak concern in the IGBT stack up. At Indium Corporation, we're redefining how we use solder at the die-attach, substrate, and

Seth Homer: Hybrid electric vehicles, green energy and power management are just a few of the industries taking advantage of insulated gate bipolar transistors technology or IGBTs. But when you

Phil Zarrow: Derrick, solder preforms. What are they? Derrick Herron: Well, a solder preform is a defined shape and size of a solder alloy. It can be used in place or in conjunction with a solder